000Z9
Manufacturer
Model
000Z9
Category
PANJIT International MMBD7000_R1_000Z9 is a SOT-23 package switching diode suitable for low-power scenarios, featuring fast switching characteristics (trr≤5ns) and low capacitance (≤5pF), applicable to DC-DC converters, sensor nodes, and wearable device power management. Its key parameters include maximum repetitive peak voltage ±50V, continuous current 1A (TAI=85℃), and attention should be paid to electrostatic protection and welding temperature control. The device performs excellently in cost-sensitive applications, but due to limitations in voltage range and high-temperature performance, it is recommended to use it in an environment of -40℃ to +85℃ and with heat dissipation design.
Reference Pricing
Reference Stock
Specifications
| Forward Voltage Drop | 1.1V |
| Junction Capacitance | 2pF |
| Maximum Forward Current | 0.2A |
| Maximum Reverse Voltage | 100V |
| Operating Temperature Range | -55°C to 150°C |
| Package Type | SOT-23 |
| Rated Voltage | 100V |
| Reverse Recovery Time | 4ns |
| Switching Speed | 4ns |
| Thermal Resistance | 556°C/W |
Function And Role
Core Function
Switching diode for low-power signal and power applications
Key Characteristics
- SOT-23 package
- fast switching characteristics
- low capacitance
- RoHS compliant
Application Domains
Basic Scenarios
- DC-DC power converter
- signal demodulation circuit
- low-power sensor node
Extended Scenarios
- wearable device power management
- portable electronic device signal processing
- industrial control circuit
Precautions
| Soldering | It is recommended to use a fine needle tip of 0.2-0.3mm, peak temperature ≤260℃ (10 seconds) |
| Current Limit | Maximum continuous current 1A (TAI=85℃) |
| Voltage Limit | Repetitive peak voltage -20V to +50V |
| Thermal Management | A heat sink is required when the junction temperature exceeds 125℃ |
| Storage | Humidity <10% environment, temperature -40℃ to +85℃ |
| Risk Warnings |
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Alternative Model Params
- Reverse recovery time (trr) ≤5ns
- Junction capacitance ≤5pF
- Operating temperature range
Design Recommendations
| Layout | Maintain pad spacing >2mm, prefer bottom-facing welding |
| Thermal | It is recommended to reserve a 10mm heat dissipation area in PCB layout |
| Compatibility | Compatible with 0805 package components |
| Testing | ESD testing (contact discharge ±3000V) is required |
Market Positioning
| Strengths |
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| Weaknesses |
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Datasheet
Assist inquiry
Distributors
Shenzhen Zhongxing Tai Electronic Co., Ltd.
Shenzhen Anxinmei Electronics Co., Ltd.
Shenzhen Futian District Bin Fengsheng Electronic Business Department
Shenzhen Beihuada Electronics Co., Ltd.
Baoma Microelectronics (Shenzhen) Co., Ltd.
Shenzhen BF Electronics Co., Ltd.
Shenzhen Mingcai Electronic Co., Ltd.
Shenzhen Chengxin Chip Technology Co., Ltd.
Shenzhen Chaolongye Electronic Technology Co., Ltd.
Shenzhen Baixin Microelectronics Co., Ltd.
Shenzhen Dadi Huayu Electronics Co., Ltd.
Shenzhen Decheng Xingye Technology Co., Ltd.
Shenzhen DeYang Electromechanical Co., Ltd.
Shenzhen Kaixin Yue Electronics Co., Ltd.
Shenzhen Yaoxin Technology Co., Ltd.
Shenzhen Xinyuhang Electronic Co., Ltd.
Shenzhen Qili Technology Co., Ltd.
Shenzhen Xinyi Electronics Co., Ltd.
Shenzhen Century Jinfeng Technology Co., Ltd.
Shenzhen Jihuisheng Technology Co., Ltd.
Shenzhen Hui Shengxin Electronic Technology Co., Ltd.
Shenzhen Xinteng Hongxin Electronic Technology Co., Ltd.
Shenzhen Bainei Information Technology Co., Ltd.
Shenzhen Pengxin Microelectronics Technology Co., Ltd.
Shenzhen Junbang Electronics Co., Ltd.
Shenzhen Yuanzhuang Weirun Technology Co., Ltd.
Shenzhen Mingxin Electronic Technology Co., Ltd.
Shenzhen Futian District Jintaielectronics Technology Trade
Shenzhen Junengda Electronics Co., Ltd.
Shenzhen Ju Rong Electronics Co., Ltd.