02-1518-00
Manufacturer
Model
02-1518-00
Category
The C6375020 2P DIP socket features gold-plated beryllium copper contacts for reliable connections in prototyping and industrial applications, offering corrosion resistance and mechanical durability within -40°C to +125°C range. Its 2.54mm pitch ensures compatibility with standard DIP devices, while soldering must avoid thermal damage. Best suited for low-pin-count systems requiring high-reliability connections in harsh environments.
Reference Pricing
Reference Stock
Specifications
| Color | Black |
| Contact Pressure | 180g/pin |
| Contact Resistance | ≤50mΩ |
| Dimensions | Please refer to the drawings |
| Insulation Resistance | ≥100MΩ |
| Material | Copper, Nylon |
| Mechanical Strength | Please refer to the drawings |
| Number of Contacts | 4 |
| Operating Temperature Range | -67°F to 221°F / -55°C to 105°C |
| Rated Voltage | 250V |
| Voltage Rating | 250V |
| Weight | Please refer to the drawings |
Function And Role
Core Function
DIP socket for connecting integrated circuits or transistors
Key Characteristics
- 2.54mm pitch spacing
- Gold-plated contacts
- Beryllium copper alloy construction
Application Domains
Basic Scenarios
- Circuit prototyping
- PCB assembly for low-pin-count devices
Extended Scenarios
- Industrial automation systems
- High-reliability military/aerospace applications
Precautions
| Soldering | Avoid prolonged heat exposure (max 300°C soldering iron tip temperature) |
| Current Limit | N/A (depends on connected device specifications) |
| Voltage Limit | N/A (depends on device requirements) |
| Thermal Management | Operating temperature range -40°C to +125°C (requires proper heat dissipation) |
| Storage | Store in dry, cool environment away from static discharge sources |
| Risk Warnings |
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Alternative Model Params
- Pitch (2.54mm)
- Contact plating (gold)
- Material (beryllium copper alloy)
- Pin count (2P)
Design Recommendations
| Layout | Ensure 2.54mm spacing alignment with PCB pad design |
| Thermal | Use thermal vias for heat dissipation in high-power applications |
| Compatibility | Verify compatibility with 2P DIP IC/transistor packages |
| Testing | Test contact resistance (target <10mΩ) after soldering |
Market Positioning
| Strengths |
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| Weaknesses |
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