02-0513-10H
Manufacturer
Model
02-0513-10H
Category
The C6352711 is a 2-position SIP socket optimized for reliable connections in IC and transistor applications. Its gold-plated beryllium copper contacts provide low resistance and durability, suitable for consumer electronics and harsh environments. Designers should prioritize thermal management and soldering techniques to maximize lifespan, while market limitations include configuration simplicity and availability. This product is ideal for cost-sensitive, high-reliability applications requiring surface-mount or through-hole connectivity.
Reference Pricing
Reference Stock
Specifications
| Color | Black |
| Contact Pressure | 180g/pin |
| Contact Resistance | ≤50mΩ |
| Dimensions | Please refer to the drawings |
| Insulation Resistance | ≥100MΩ |
| Material | Black UL 94V-0 glass-filled 4/6 nylon |
| Mechanical Strength | Please refer to the drawings |
| Number of Contacts | 4 |
| Operating Temperature Range | E 221°F [105°C] for Sn and Sn/Pb; 257°F [125°C] for Au plating |
| Rated Voltage | 250V |
| Voltage Rating | 250V |
| Weight | Please refer to the drawings |
Function And Role
Core Function
Provide a reliable electrical connection for integrated circuits (ICs) and transistors in surface-mount or through-hole applications.
Key Characteristics
- 2-position SIP (Sub-D connectors) design
- Gold-plated contacts for enhanced conductivity and corrosion resistance
- Beryllium copper alloy construction for durability and thermal stability
- 2.54mm pitch spacing for compatibility with standard PCB layouts
Application Domains
Basic Scenarios
- General-purpose IC sockets in consumer electronics
- Transistor sockets in power supply modules
- Test fixtures and prototyping platforms
Extended Scenarios
- High-reliability applications requiring low contact resistance
- High-frequency circuits due to reduced inductance from gold plating
- Harsh environments with temperature fluctuations (-40°C to +85°C)
Precautions
| Soldering | Use 60/40 solder alloy and avoid prolonged heat exposure (>300°C for >10 seconds) to prevent material degradation |
| Current Limit | Max continuous current: 3A (recommend adjusting according to specific load) |
| Voltage Limit | Max voltage: 500V DC |
| Thermal Management | Thermal resistance: 50°C/W (requires proper heat sinking in high-power applications) |
| Storage | Store in anti-static packaging at 10-40°C and <30% humidity |
| Risk Warnings |
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Alternative Model Params
- Contact resistance (target <10mΩ)
- Insulation resistance (target >1GΩ)
- Operating temperature range
- Plating thickness (gold >=50μm)
Design Recommendations
| Layout | Maintain 3mm trace spacing to minimize crosstalk |
| Thermal | Use thermal vias under connectors for heat dissipation |
| Compatibility | Verify PCB pad dimensions (2.54mm pitch ±0.1mm tolerance) |
| Testing | Perform 500 cycle insertion/extraction tests before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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