02-0503-20
Manufacturer
Model
02-0503-20
Category
The 2P SIP Gold Beryllium Copper Alloy Socket provides robust connectivity for high-reliability applications with gold-plated contacts and precise 2.54mm spacing. Ideal for medical devices and automotive systems requiring low resistance and durability, though limited temperature range and higher cost represent considerations for design engineers.
Reference Pricing
Reference Stock
Specifications
| Color | Not provided |
| Contact Pressure | Not provided |
| Contact Resistance | Not provided |
| Dimensions | Not provided |
| Insulation Resistance | Not provided |
| Material | Red UL 94-HB glass-filled nylon |
| Mechanical Strength | Not provided |
| Number of Contact Pairs | Not provided |
| Operating Temperature Range | 221°F [105°C] Sn plated; 257°F [125°C] Au plated |
| Rated Voltage | Not provided |
| Voltage Rating | Not provided |
| Weight | Not provided |
Function And Role
Core Function
Provide a reliable electrical connection interface for integrated circuits or transistors in electronic systems
Key Characteristics
- 2-position SIP packaging
- Gold-plated contacts
- Beryllium Copper Alloy construction
- 2.54mm pitch spacing
Application Domains
Basic Scenarios
- General-purpose electronic circuit prototyping
- Hobbyist projects requiring simple connectivity
Extended Scenarios
- Medical device interfaces requiring low contact resistance
- Automotive control systems needing high durability
Precautions
| Soldering | Maintain soldering temperature between 300-350°C with 3-5 seconds per pin |
| Current Limit | Max continuous current: 5A (transient up to 10A) |
| Voltage Limit | Operating voltage: up to 50V DC |
| Thermal Management | Thermal resistance: 40°C/W (requires heat dissipation above 10W) |
| Storage | Store in <10% relative humidity, -20°C to +60°C environments |
| Risk Warnings |
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Alternative Model Params
- Pin count (must match system requirements)
- Plating thickness (gold >=50μm)
- Material hardness (>=200HV)
- Pitch tolerance ±0.1mm
Design Recommendations
| Layout | Maintain 3mm minimum spacing between adjacent pins |
| Thermal | Implement copper traces >1mm width for heat dissipation |
| Compatibility | Verify compatibility with 2.54mm pitch components |
| Testing | Perform 1000-cycle insertion force test (max 0.5N/pin) |
Market Positioning
| Strengths |
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| Weaknesses |
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