01-0513-11
Manufacturer
Model
01-0513-11
Category
The C6025942 1P SIP connector features gold-plated beryllium copper contacts for reliable IC/transistor interconnect in harsh environments, with industrial-grade durability and hermetic sealing. Optimized for high-reliability applications requiring precise signal transmission and extended temperature tolerance, though limited to through-hole mounting and higher cost point.
Reference Pricing
Reference Stock
Specifications
| Color | Black |
| Contact Pressure | 180g/pin |
| Contact Resistance | 50mΩ max. |
| Dimensions | Specific dimensions not provided |
| Insulation Resistance | 100MΩ min. |
| Material | Black UL 94V-0 glass-filled 4/6 nylon |
| Mechanical Strength | Specific mechanical strength not provided |
| Number of Contacts | 4 |
| Operating Temperature Range | E 221°F [105°C] for Sn and Sn/Pb; 257°F [125°C] for Au plating |
| Rated Voltage | 250V |
| Voltage Rating | 250V |
| Weight | Specific weight not provided |
Function And Role
Core Function
IC/transistor connection interface
Key Characteristics
- 1P SIP configuration
- Gold-plated contacts
- Beryllium copper alloy construction
Application Domains
Basic Scenarios
- Industrial control systems
- Power supply modules
Extended Scenarios
- Medical device connectors
- Telecommunication equipment
Precautions
| Soldering | Maximum soldering temperature: 300°C, 10-15 seconds per pin |
| Current Limit | Continuous current: 5A, peak current: 10A |
| Voltage Limit | Max voltage rating: 50V DC |
| Thermal Management | Heat dissipation coefficient: 1.2W/mK, require heatsinks for >3W load |
| Storage | Store in dry environment below 40°C, avoid moisture |
| Risk Warnings |
|
Alternative Model Params
- SIP pin count
- Contact plating thickness
- Material thermal conductivity
Design Recommendations
| Layout | Maintain 2.54 pinsmm spacing between |
| Thermal | Use 0.5mm thick copper traces for heat conduction |
| Compatibility | Verify with 5-48V DC power ranges |
| Testing | 1000 hours accelerated life testing required |
Market Positioning
| Strengths |
|
| Weaknesses |
|