01-0513-10T
Manufacturer
Model
01-0513-10T
Category
The C5458720 is a high-reliability 1-position SIP socket featuring gold-plated beryllium copper contacts for optimal conductivity and durability. Designed for precision soldering at 300-350℃ with 3-5s contact time, it supports extended temperature ranges up to 85℃ and offers superior corrosion resistance. Ideal for medical devices and aerospace applications requiring long-term reliability, though its single-position design limits flexibility compared to multi-pin alternatives.
Reference Pricing
Reference Stock
Specifications
| Color | Black |
| Contact Pressure | 180g/pin |
| Contact Resistance | 50mΩ max. |
| Dimensions | Specific dimensions not provided |
| Insulation Resistance | 100MΩ min. |
| Material | Black UL 94V-0 glass-filled 4/6 nylon |
| Mechanical Strength | Specific mechanical strength not provided |
| Number of Contacts | 4 |
| Operating Temperature Range | E 221°F [105°C] for Sn and Sn/Pb; 257°F [125°C] for Au plating |
| Rated Voltage | 250V |
| Voltage Rating | 250V |
| Weight | Specific weight not provided |
Function And Role
Core Function
Provide a 1-position SIP socket for secure connection of ICs/transistors with gold-plated contacts
Key Characteristics
- 1-position SIP design
- Gold-plated contacts
- Beryllium copper alloy construction
Application Domains
Basic Scenarios
- General-purpose IC/transistor prototyping
- Low-power electronics assembly
Extended Scenarios
- Medical device connectors
- Aerospace-grade interconnects
Precautions
| Soldering | Maintain 300-350℃ soldering temperature with 3-5s contact time |
| Current Limit | - |
| Voltage Limit | - |
| Thermal Management | Max operating temperature 85℃; ensure 10°C above ambient during soldering |
| Storage | Store in dry environment below 30°C with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Number of Positions (1P)
- Adaptation Package Type (SIP)
- Contact Plating (Gold)
- Contact Material (Beryllium Copper Alloy)
Design Recommendations
| Layout | Ensure 2.54mm pitch alignment with adjacent components |
| Thermal | Use thermal vias in adjacent PCB layers |
| Compatibility | Verify compatibility with 0.64mm thick PCBs |
| Testing | Perform 500 cycle insertion/extraction testing and contact resistance measurement |
Market Positioning
| Strengths |
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| Weaknesses |
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