01-0513-10
Manufacturer
Model
01-0513-10
Category
The 1P SIP gold beryllium copper alloy socket (C6056249) provides reliable interconnect solutions for high-reliability applications requiring low resistance and mechanical durability. Its gold-plated contacts ensure stable connections in low-voltage circuits, while the beryllium copper alloy construction resists corrosion and thermal stress. Suitable for medical devices, automotive controls, and industrial automation, though designers must verify thermal specifications and mechanical compatibility with specific components.
Reference Pricing
Reference Stock
Specifications
| Color | Black |
| Contact Pressure | 180g/pin |
| Contact Resistance | 10mΩ max. |
| Dimensions | Specific dimensions not provided |
| Insulation Resistance | 100MΩ min. |
| Material | Black UL 94V-0 glass-filled 4/6 nylon |
| Mechanical Strength | Specific mechanical strength not provided |
| Number of Contacts | 4 |
| Operating Temperature Range | E 221°F [105°C] for Sn and Sn/Pb; 257°F [125°C] for Au plating |
| Rated Voltage | 250V |
| Voltage Rating | 250V |
| Weight | Specific weight not provided |
Function And Role
Core Function
1P SIP gold-plated beryllium copper alloy socket for IC/transistor insertion
Key Characteristics
- Gold-plated contact for low resistance
- Beryllium copper alloy construction for durability
- SIP (Single In-line Package) configuration
Application Domains
Basic Scenarios
- Basic circuit prototyping
- Low-power transistor integration
- IC testing stations
Extended Scenarios
- Medical device interconnects
- Automotive control systems
- High-reliability industrial automation
Precautions
| Soldering | Maintain soldering temperature below 300°C to prevent gold plating degradation |
| Current Limit | Max current: 5A (requires derating for extended periods) |
| Voltage Limit | Max voltage: 200V DC |
| Thermal Management | Ensure proper heat dissipation in high-power applications |
| Storage | Store in controlled environment (15-25°C, <30% RH) with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Contact material (Beryllium copper alloy)
- Plating thickness (>=1.5μm gold)
- SIP pin count (1P)
- Operating temperature range
Design Recommendations
| Layout | Maintain 3mm minimum spacing between adjacent connectors |
| Thermal | Use thermal vias under connector pads for heat dissipation |
| Compatibility | Verify mechanical compatibility with target IC/transistor footprints |
| Testing | Perform insertion force test (≤50g) and contact resistance test (<10mΩ) |
Market Positioning
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