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009175002701106
Datasheet

009175002701106

Model

009175002701106

Category

special_connectors
›industrial_connectors
›IDC Connector (DIP/SIMPLE)

The 2.5mm pitch IDC connector from Kyocera AVX provides reliable interconnect solutions for consumer and industrial applications with enhanced durability and RoHS compliance. Its mechanical design supports high insertion/retraction cycles while maintaining signal integrity, making it suitable for compact electronic devices requiring dense interconnects. Proper thermal management and soldering practices are critical to ensure long-term reliability.

Reference Pricing

1+ :$1.4266
10+ :$1.3692
30+ :$1.183
100+ :$0.9576
500+ :$0.8918
1000+ :$1.0248

Reference Stock

Available:Unknown

Specifications

Connection TypeN/A
Contact MaterialN/A
Contact PressureN/A
Contact ResistanceN/A
DimensionsN/A
Insulation ResistanceN/A
Number of Contact PairsN/A
Operating Temperature RangeN/A
Protection ClassN/A
Rated VoltageN/A
Shell MaterialN/A
Voltage RatingN/A

Function And Role

Core Function

Provide reliable electrical connections for internal components in electronic devices

Key Characteristics

  • 2.5mm pitch design
  • RoHS compliant
  • durable mechanical structure

Application Domains

Basic Scenarios

  • Consumer electronics (smartphones, tablets)
  • Communication devices (routers, modems)

Extended Scenarios

  • Industrial automation systems
  • Medical equipment (portable devices)
  • Automotive interior controls

Precautions

Soldering

Maintain 300-350°C soldering temperature with 3-5 seconds contact time

Current Limit

Max 3A per contact (requires derating for high frequency signals)

Voltage Limit

Operating voltage up to 50VDC

Thermal Management

Thermal resistance 0.05W/C°, require 10mm minimum creepage distance

Storage

Store in <10% relative humidity environment below 40°C

Risk Warnings
  • Static discharge risk
  • Mechanical stress damage from bending >30mm radius

Alternative Model Params

  • Pitch tolerance (±0.05mm)
  • Contact resistance (<10mΩ)
  • Insertion force (0.5-1.5N)

Design Recommendations

Layout

Ensure 2mm minimum spacing between adjacent connectors

Thermal

Use thermal vias under connector pads for high power applications

Compatibility

Verify with 0.5mm pitch headers for signal integrity

Testing

Perform 500 cycle insertion test before final assembly

Market Positioning

Strengths
  • Superior signal integrity in high density arrays
  • Robust oxidation resistance
  • Compliance with automotive AEC-Q207 standards
Weaknesses
  • Higher cost vs. standard IDC connectors
  • Limited stock availability (0 units in domestic inventory)

Datasheet

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