000LE
Manufacturer
Model
000LE
Category
The PANJIT International SS14_R1_000LE is a cost-effective SMA Schottky diode optimized for power electronics with low forward voltage and ROHS compliance, suitable for DC-DC conversion and renewable energy systems. Its moisture-sensitive package requires controlled storage and soldering practices, while thermal management must prioritize junction temperature control. The device is positioned as a budget-friendly alternative for low-voltage applications but lacks advanced protection features compared to higher-cost diodes.
Reference Pricing
Reference Stock
Specifications
| Forward Voltage Drop | 0.5V |
| Maximum Forward Current | 1A |
| Maximum Reverse Voltage | 60V |
| Operating Temperature Range | -55 to +125°C |
| Package Type | SMA |
| Rated Current | Not specified |
| Rated Voltage | Not specified |
| Reverse Leakage Current | 0.1mA |
| Switching Speed | Not specified |
Function And Role
Core Function
Rectification, voltage clamping, and low forward voltage drop in power electronics
Key Characteristics
- SMA surface-mount package
- ROHS compliance
- Moisture sensitivity level 1
Application Domains
Basic Scenarios
- DC-DC power supply circuits
- Reverse polarity protection
- Low-loss switching applications
Extended Scenarios
- Renewable energy systems
- High-frequency inverters
- Automotive battery management
Precautions
| Soldering | Use fine tip soldering iron (≤300°C) and avoid prolonged heat exposure |
| Current Limit | Max continuous current 1A (derate to 50% at 150°C) |
| Voltage Limit | Max reverse voltage 200V (check datasheet for exact rating) |
| Thermal Management | Critical junction temperature (Tj) <150°C with 10W thermal resistance |
| Storage | Store in dry (<10% RH), cool (<25°C) environment in anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Package type (SMA)
- Max reverse voltage (≥150V)
- Current handling (≥0.8A)
- ROHS compliance
Design Recommendations
| Layout | Maintain <10mil trace width for power paths |
| Thermal | Implement copper pour or thermal via near junction |
| Compatibility | Verify footprint with 0805/1206 pad dimensions |
| Testing | Perform in-circuit ESD testing (±3000V HBM) |
Market Positioning
| Strengths |
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| Weaknesses |
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Datasheet
Assist inquiry
Distributors
Shenzhen Zhongxing Tai Electronic Co., Ltd.
Shenzhen Anxinmei Electronics Co., Ltd.
Shenzhen Futian District Bin Fengsheng Electronic Business Department
Shenzhen Beihuada Electronics Co., Ltd.
Baoma Microelectronics (Shenzhen) Co., Ltd.
Shenzhen BF Electronics Co., Ltd.
Shenzhen Mingcai Electronic Co., Ltd.
Shenzhen Chengxin Chip Technology Co., Ltd.
Shenzhen Chaolongye Electronic Technology Co., Ltd.
Shenzhen Baixin Microelectronics Co., Ltd.
Shenzhen Dadi Huayu Electronics Co., Ltd.
Shenzhen Decheng Xingye Technology Co., Ltd.
Shenzhen DeYang Electromechanical Co., Ltd.
Shenzhen Kaixin Yue Electronics Co., Ltd.
Shenzhen Yaoxin Technology Co., Ltd.
Shenzhen Xinyuhang Electronic Co., Ltd.
Shenzhen Qili Technology Co., Ltd.
Shenzhen Xinyi Electronics Co., Ltd.
Shenzhen Century Jinfeng Technology Co., Ltd.
Shenzhen Jihuisheng Technology Co., Ltd.
Shenzhen Hui Shengxin Electronic Technology Co., Ltd.
Shenzhen Xinteng Hongxin Electronic Technology Co., Ltd.
Shenzhen Bainei Information Technology Co., Ltd.
Shenzhen Pengxin Microelectronics Technology Co., Ltd.
Shenzhen Junbang Electronics Co., Ltd.
Shenzhen Yuanzhuang Weirun Technology Co., Ltd.
Shenzhen Mingxin Electronic Technology Co., Ltd.
Shenzhen Futian District Jintaielectronics Technology Trade
Shenzhen Junengda Electronics Co., Ltd.
Shenzhen Ju Rong Electronics Co., Ltd.