002-151-001
Manufacturer
Model
002-151-001
Category
The C21547847 photodiode is optimized for high-sensitivity optical signal detection with ROHS compliance and industrial-grade reliability. It supports basic applications in communication systems and extends to precision LiDAR and medical devices with proper thermal management. Key design considerations include moisture protection during storage and controlled soldering profiles to prevent package damage. While offering excellent performance in controlled environments, its availability and cost profile may impact large-scale adoption.
Reference Pricing
Reference Stock
Specifications
| Light Responsivity | 1.0 A/W |
| Maximum Forward Current | 50 mA |
| Maximum Power Dissipation | 500 mW |
| Operating Temperature Range | -40°C - +125°C |
| Package Type | - |
| Rated Current | 50 mA |
| Rated Voltage | 5V |
| Reverse Leakage Current | 1 nA |
| Spectral Response Range | 800 nm - 1700 nm |
Function And Role
Core Function
Converts optical signals to electrical current
Key Characteristics
- High sensitivity to specific wavelengths
- ROHS compliant
- Tape & Reel packaging
Application Domains
Basic Scenarios
- Optical communication systems
- Photonic sensors
- Low-light detection
Extended Scenarios
- Medical imaging devices
- Automotive LiDAR systems
- Environmental monitoring sensors
Precautions
| Soldering | Maximum reflow temperature: 260°C (±10°C) for 20-30 seconds |
| Current Limit | Max continuous current: 10mA (absolute maximum 50mA) |
| Voltage Limit | Reverse breakdown voltage: <5V |
| Thermal Management | Thermal resistance: 25°C/W at junction-to-case |
| Storage | Moisture sensitivity level 3 (168-hour storage at 85% RH) |
| Risk Warnings |
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Alternative Model Params
- Wavelength range (nm)
- responsivity (A/W)
- dark current (nA)
- package type
Design Recommendations
| Layout | Ensure 10mm minimum trace spacing for high-frequency signals |
| Thermal | Use copperpour heat dissipation pad under package |
| Compatibility | Verify with 3.3V/5V logic levels |
| Testing | Perform wavelength response verification after assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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