0.8-8PLT
Manufacturer
Model
0.8-8PLT
Category
The SHOU HAN 0.8-8PLT provides a cost-effective 8-pin SMD wire-to-board connector with 0.8mm pitch, tin-plated copper alloy contacts, and a -25°C to +85°C operating range. Ideal for consumer electronics and automotive interiors, it offers reliable connectivity at 500mA with proper soldering techniques and thermal management. Its ROHS compliance supports environmental regulations while maintaining competitive pricing through optimized manufacturing processes.
Reference Pricing
Reference Stock
Specifications
| Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
| Interface Type | As per specific model |
| Material | Phosphor bronze |
| Number of Pins | As per specific model |
| Operating Temperature Range | As per specific model |
| Pitch | As per specific model |
| Welding Method | As per specific model |
Function And Role
Core Function
Wire-to-board connectivity solution for PCB assembly
Key Characteristics
- 8-position vertical soldering connector
- 0.8mm pitch spacing
- Tin-plated copper alloy contacts
- 500mA current rating
- Operating temperature range: -25°C to +85°C
- ROHS compliant
Application Domains
Basic Scenarios
- Consumer electronics assembly
- Industrial control systems
- Automotive interior wiring
Extended Scenarios
- Medical device connectivity
- Automotive sensor networks
- Automated test equipment
Precautions
| Soldering | Maintain 300-350°C soldering temperature with 3-5 seconds contact time |
| Current Limit | Max continuous current: 500mA ( peak: 1A for 10 seconds) |
| Voltage Limit | Max voltage rating: 30V DC |
| Thermal Management | Limit power dissipation to <0.5W per contact |
| Storage | Store in <10% relative humidity, temperature-controlled environment |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.5-1.25mm range)
- Contact material (copper/tin alloy variants)
- Operating temperature (-40°C to +105°C extension)
- Current rating (200-1000mA variants)
Design Recommendations
| Layout | Ensure 2.5mm minimum PCB pad spacing |
| Thermal | Use thermal vias for heat dissipation in high-cycle applications |
| Compatibility | Verify solder mask compatibility with tin finish |
| Testing | Perform 100% AOI inspection for solder joints |
Market Positioning
| Strengths |
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| Weaknesses |
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