0.8-3PLT
Manufacturer
Model
0.8-3PLT
Category
The SHOU HAN 0.8-3PLT SMD connector provides a cost-effective solution for 3-pin vertical wire-to-board connections in industrial and automotive applications, offering reliable performance from -25°C to +85°C with 500mA current handling. Its tin-plated copper alloy contacts ensure good conductivity while maintaining RoHS compliance. The 0.8mm pitch design suits compact PCB layouts, but users should pay attention to thermal management and verify soldering parameters to avoid connection failures.
Reference Pricing
Reference Stock
Specifications
Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
Interface Type | Not provided |
Material | Phosphor bronze |
Operating Temperature Range | Not provided |
Pins | Not provided |
Pitch | Not provided |
Welding Method | Not provided |
Function And Role
Core Function
Connects wire harnesses to PCBs via vertical soldering
Key Characteristics
- 1x3P pin configuration
- 0.8mm pitch SMD design
- Tin-plated copper alloy contacts
- 500mA current rating
- 30V voltage rating
- Operating temperature range: -25°C to +85°C
- Vertical surface mount soldering
Application Domains
Basic Scenarios
- Consumer electronics assembly
- Industrial control systems
- Automotive interior wiring
Extended Scenarios
- Medical device connectivity
- Automotive under-hood environments
- Telecom infrastructure
Precautions
Soldering | Use 300-350°C soldering iron with 0.5-1.0s contact time |
Current Limit | Max continuous current: 500mA |
Voltage Limit | Max voltage: 30V DC |
Thermal Management | Thermal resistance: 50°C/W |
Storage | Store in <10% RH, 15-25°C environment |
Risk Warnings |
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Alternative Model Params
- Pitch (0.5-1.2mm range)
- Contact material (copper/tin alloy)
- Current rating (200-1000mA)
- Temperature range (-40°C to +105°C)
Design Recommendations
Layout | Ensure 2mm trace spacing for adjacent pins |
Thermal | Use decoupling capacitors within 5mm |
Compatibility | Verify PCB pad dimensions (1.2mm x 1.5mm) |
Testing | Perform 500 thermal cycling tests |
Market Positioning
Strengths |
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Weaknesses |
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