0.8-15PLT
Manufacturer
Model
0.8-15PLT
Category
This 15-pin vertical wire-to-board connector offers cost-effective interconnect solutions for consumer electronics and industrial applications. Its 0.8mm pitch design supports compact PCB layouts while maintaining 500mA current handling and -25°C to +85°C operational range. The tin-plated copper alloy contacts provide reliable connectivity with proper soldering techniques. Ideal for mass production environments requiring RoHS compliance and moderate electrical performance.
Reference Pricing
Reference Stock
Specifications
| Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
| Interface Type | Not provided |
| Material | Phosphor bronze |
| Operating Temperature Range | Not provided |
| Pins | Not provided |
| Pitch | Not provided |
| Welding Method | Not provided |
Function And Role
Core Function
Connecting wires to printed circuit boards (PCBs) in vertical soldering configurations
Key Characteristics
- 15 pins with 0.8mm pitch
- Tin-plated copper alloy contacts
- 500mA current rating
- 30V voltage rating
- Operating temperature range: -25°C to +85°C
- Vertical soldering compatible
- RoHS compliant
Application Domains
Basic Scenarios
- Consumer electronics (power distribution, signal routing)
- Industrial control systems (terminals, interconnects)
- Automotive interior systems (wire harnesses)
Extended Scenarios
- Medical devices (portable equipment, patient monitoring)
- Internet of Things (IoT) nodes (power/signal interconnects)
- Renewable energy systems (solar inverter terminals)
Precautions
| Soldering | Maintain soldering temperature between 260-280°C and time <3 seconds per pin to prevent pad lifting |
| Current Limit | Max continuous current: 500mA (surges up to 1A for 10s) |
| Voltage Limit | Max voltage: 30V RMS continuous |
| Thermal Management | Thermal resistance: 40°C/W (requires 10x10mm copper area for heat dissipation) |
| Storage | Store in <10% relative humidity, -18°C to 40°C environments |
| Risk Warnings |
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Alternative Model Params
- Pin count (10-20P range)
- Pitch (0.5-1.25mm increments)
- Plating type (Tin/Nickel plated)
- Current rating (300-1000mA)
- Operating temperature (-40°C to +105°C)
- Soldering type (Vertical/Angled)
Design Recommendations
| Layout | Use 0.8mm pitch staggered layout for better mechanical stability |
| Thermal | Implement thermal vias under pins for heat dissipation |
| Compatibility | Verify withIPC-7251 standards for assembly processes |
| Testing | Perform 500cycle life testing under 500mA/30V conditions |
Market Positioning
| Strengths |
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| Weaknesses |
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