0.8-14PLT
Manufacturer
Model
0.8-14PLT
Category
The SHOU HAN 0.8-14PLT is a cost-effective 14-pin SMD wire-to-board connector designed for vertical soldering applications in consumer electronics, automotive, and industrial equipment. Its tin-plated copper alloy contacts provide reliable connectivity within -25°C to +85°C, supporting 500mA current and 30V voltage. Key design considerations include thermal management via 50°C/W resistance and anti-static storage. While suitable for standard industrial use, its limitations in high-voltage and extreme environments should be noted.
Reference Pricing
Reference Stock
Specifications
| Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
| Interface Type | Not provided |
| Material | Phosphor bronze |
| Number of Pins | Not provided |
| Operating Temperature Range | Not provided |
| Pitch | Not provided |
| Welding Method | Not provided |
Function And Role
Core Function
1x14P wire-to-board connector for vertical soldering on PCBs with 0.8mm pitch
Key Characteristics
- Tin-plated copper alloy contacts
- Operating temperature range: -25°C to +85°C
- 500mA current rating
- 30V voltage rating
- SMD tape & reel packaging
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices, wearables)
- Automotive interior controls
- Industrial equipment interfaces
Extended Scenarios
- Medical device connectivity
- Automotive under-hood systems
- Renewable energy inverters
- Telecom infrastructure
Precautions
| Soldering | Use 250-300°C solder profile with 3-5s dwell time to prevent pad lifting |
| Current Limit | Max continuous current: 500mA (surge <1s: 1A) |
| Voltage Limit | Max working voltage: 30V DC |
| Thermal Management | Thermal resistance: 50°C/W; ensure 10mm clearance from heat sources |
| Storage | Store in <10% RH, 5-40°C environments in anti-static packaging |
| Risk Warnings |
|
Alternative Model Params
- Pitch (0.5-1.25mm)
- Contact material (copper/tin-plated)
- Operating temperature range
- Current/voltage ratings
- Soldering type (vertical/reverse)
Design Recommendations
| Layout | Maintain 2mm trace spacing between adjacent pins |
| Thermal | Use thermal vias under contact pads for heat dissipation |
| Compatibility | Verify with 1.2mm-1.6mm PCB thickness |
| Testing | Perform 500 cycle insertion test per IEC 61076-2-101 |
Market Positioning
| Strengths |
|
| Weaknesses |
|