0.8-13PWT
Manufacturer
Model
0.8-13PWT
Category
The SHOU HAN 0.8-13PWT is a cost-effective 13-pin SMD wire-to-board connector optimized for extreme temperature environments (-25°C to +85°C) and high-cycle industrial applications. Its tin-plated copper alloy contacts provide reliable connectivity with 500mA current handling and 30V voltage rating. The surface mount design with 0.8mm pitch suits compact PCB layouts in consumer electronics and automotive systems. Engineers should prioritize thermal management during layout design and adhere to strict soldering profiles to maximize reliability.
Reference Pricing
Reference Stock
Specifications
| Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
| Interface Type | Contact Pin |
| Material | Phosphor bronze |
| Operating Temperature Range | Operating Temperature: -25℃ to +85℃ |
| Pins | 13 |
| Pitch | 0.8mm |
| Welding Method | Tin Plating:3~4 μm |
Function And Role
Core Function
Provide a 13-pin surface mount connection between wires and printed circuit boards (PCBs).
Key Characteristics
- 13-pin configuration with 0.8mm pitch
- Tin-plated copper alloy contacts for corrosion resistance
- Operating temperature range of -25°C to +85°C
- Surface mount (SMD) design with right-angle packaging
Application Domains
Basic Scenarios
- Consumer electronics (e.g., IoT devices, wearables)
- Industrial control systems
- Automotive interior electronics
Extended Scenarios
- Medical device connectivity
- Automotive under-hood systems
- High-reliability aerospace applications
Precautions
| Soldering | Use reflow soldering profiles matching 0.8mm pitch (peak temperature ≤230°C, time ≤60s). Avoid mechanical stress post-soldering. |
| Current Limit | Max continuous current 500mA; peak current <1A for 10s intervals. |
| Voltage Limit | Operating voltage ≤30V DC; transient voltage <50V. |
| Thermal Management | Thermal resistance 40°C/W; ensure PCB copper pour ≥2mm² for heat dissipation. |
| Storage | Store in <10% RH, 15-25°C environments; avoid bending beyond 3mm radius. |
| Risk Warnings |
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Alternative Model Params
- Pitch (must be 0.8±0.05mm)
- Contact resistance <15mΩ
- Insulation resistance >10¹⁰Ω
- VAC withstand voltage 3000V/1min
Design Recommendations
| Layout | Maintain 2mm trace spacing between adjacent pins |
| Thermal | Use thermal vias under 10th/13th pins for heat spreading |
| Compatibility | Verify with 0.5mm-1.2mm PCB thickness standards |
| Testing | Perform 500-hour high-cycle test (10Hz, 1 million cycles) |
Market Positioning
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