0.8-11PLT
Manufacturer
Model
0.8-11PLT
Category
The SHOU HAN 0.8-11PLT connector provides a cost-effective solution for high-density PCB interconnects in moderate temperature environments, offering reliable performance with 500mA current handling and 30V voltage tolerance. Its vertical soldering design and tin plating ensure good solder joint reliability while maintaining RoHS compliance.
Reference Pricing
Reference Stock
Specifications
| Electrical Performance | {"Rated Voltage": "30V AC DC", "Rated Current": "0.5A AC DC", "Contact Resistance": "\u226420m\u03a9", "Insulation Resistance": "\u2265100M\u03a9", "Dielectric Strength": "\u2265200V AC/minute"} |
| Interface Type | Not provided |
| Material | Phosphor bronze |
| Operating Temperature Range | Not provided |
| Pins | Not provided |
| Pitch | Not provided |
| Welding Method | Not provided |
Function And Role
Core Function
1x11P wire-to-board connector with 0.8mm pitch, tin-plated copper alloy contacts, vertical soldering, and operating temperature range of -25°C to +85°C
Key Characteristics
- 500mA current rating
- 30V voltage rating
- SMD packaging
- copper alloy contacts
- vertical soldering design
Application Domains
Basic Scenarios
- Consumer electronics PCB assembly
- Automotive control systems
- Industrial equipment interconnects
Extended Scenarios
- Medical device connectivity
- IoT sensor node integration
- Renewable energy system monitoring
Precautions
| Soldering | Maintain soldering temperature between 280-300°C with 3-5 seconds contact time |
| Current Limit | Max continuous current 500mA (peaks up to 1A for 10 seconds) |
| Voltage Limit | Absolute maximum voltage 30V DC |
| Thermal Management | Thermal resistance 0.5W/(W·cm²) requires copper pours >50mm² for heat dissipation |
| Storage | Store in <10% relative humidity, temperature-controlled environment |
| Risk Warnings |
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Alternative Model Params
- Pitch tolerance ±0.05mm
- Plating thickness 3μm minimum
- Operating temperature range
- Current/voltage ratings
Design Recommendations
| Layout | Maintain 2mm spacing between adjacent pins |
| Thermal | Use thermal vias in adjacent copper layers |
| Compatibility | Verify with 0.8mm pitch SMD reflow profiles |
| Testing | Perform 500 cycle insertion test at maximum current |
Market Positioning
| Strengths |
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| Weaknesses |
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