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XB2B-WFPS-001
Reference Pricing
1+ :$115.4104
216+ :$55.8432
504+ :$44.5354
1008+ :$51.7496
Reference Stock
Available:Unknown
Specifications
| 功能描述 | Native Device Cloud integration for data acquisition and device management. Hardware and software complete module easily joins existing 802.11 Wi-Fi infrastructures. Common XBee footprint allows OEMs to support a variety of wireless protocols. Flexible SPI and UART serial interfaces. Available in Surface Mount and Through-Hole form factors Support for low-power sleeping applications with <6uA power-down current. Over-the-air data rates up to 72 Mbps. Simple provisioning methods including Soft AP and Wi-Fi Protected Setup (WPS) |
| 尺寸 | Through-Hole: 0.960 in x 1.297 in (2.438 cm x 3.294 cm), SMT: 0.87 in x 1.33 in x 0.12 in (2.20 cm x 3.40 cm x 0.30 cm) |
| 工作温度范围 | -30°C to +85°C |
| 性能指标 | Serial Data Interface: UART up to 1 Mbps, SPI up to 6 Mbps; Configuration Method: API or AT commands; Frequency Band: ISM 2.4 GHz; ADC Inputs: 4 (12-bit); Digital 1/0: 10; Form Factor: Through-Hole, Surface Mount; Antenna Options: Through-Hole: PCB (Embedded), U.FL, RPSMA, Integrated Wire SMT: PCB (Embedded), U.FL, RF Pad; Operating Temperature: -30°C to +85°C; Dimensions (L x W): Through-Hole: 0.960 in x 1.297 in (2.438 cm x 3.294 cm), SMT: 0.87 in x 1.33 in x 0.12 in (2.20 cm x 3.40 cm x 0.30 cm); Security: WPA-PSK, WPA2-PSK and WEP; Channels: 13 channels; Wireless LAN: Standard 802.11b/g/n; Data Rates: 1 Mbps to 72 Mbps; Modulation: 802.11b: CCK, DSSS; 802.11g/n: OFDM with BPSK, QPSK, 16-QAM, 64-QAM; Transmit Power: Up to +16 dBm; Receiver Sensitivity: -93 to -71 dBm; Power Requirements: Supply Voltage 3.14 -3.46 VDC; Transmit Current: Up to 309 mA; Receive Current: 100 mA; Power-Down Current: <6 μA @ 25°C; Regulatory Approvals: FCC (USA), IC (Canada), CE/ETSI (Europe), C-TICK (Australia), Telec (Japan), Anatel (Brazil) pending. |
| 重量 | Not specified in the provided document. |
| 额定电压 | 3.14 -3.46 VDC |
Datasheet
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