0078355A7
Manufacturer
Model
0078355A7
Category
This RoHS-compliant inductor is optimized for EMI suppression and energy storage in high-reliability applications, offering compact design and temperature stability up to 150°C. Bulk pricing available for 1440+ units with thermal management requirements met through copper pour integration.
Reference Pricing
Reference Stock
Specifications
| Dimensions | OD (A): 23.57 mm, ID (B): 14.40 mm, HT (C): 8.89 mm |
| Inductance Value | 62 ± 8% nH |
| Loss | 700 mW/cm³ |
| Operating Temperature Range | Not provided |
| Package Type | - |
| Quality Factor | Not provided |
| Rated Voltage | Not provided |
Function And Role
Core Function
Energy storage, signal filtering, and electromagnetic interference (EMI) suppression in electronic circuits
Key Characteristics
- RoHS compliant
- Compact package design
- High efficiency
- Temperature-stable core material
Application Domains
Basic Scenarios
- Power supply filtering in consumer electronics
- EMI suppression in communication devices
- DC-DC converter chokes
Extended Scenarios
- Renewable energy system inductors
- High-frequency filter components in 5G infrastructure
- Automotive electronic control units
Precautions
| Soldering | Use temperature-controlled soldering irons (≤300°C) and avoid prolonged heat exposure |
| Current Limit | Max continuous current: 1.2A (derate to 800mA for operating temperatures >85°C) |
| Voltage Limit | Working voltage: up to 100V RMS (surge tolerance: 200V peak) |
| Thermal Management | Thermal resistance: 35°C/W (requires copper pours ≥100mm² for heat dissipation) |
| Storage | Store in moisture-resistant environments (relative humidity <60%) with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Inductance (μH range)
- Current rating (A)
- Operating temperature (-40°C to +150°C)
- Insulation class (Class B)
Design Recommendations
| Layout | Maintain ≥5mm clearance from high-frequency components |
| Thermal | Implement thermal vias in adjacent layers for heat dissipation |
| Compatibility | Verify with 4-layer PCB designs for impedance matching |
| Testing | Perform EMI testing per CISPR 25 standard |
Market Positioning
| Strengths |
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| Weaknesses |
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