0078224A7
Manufacturer
Model
0078224A7
Category
The C21192845 is a compact ferrite inductor designed for EMI filtering and power regulation in consumer and industrial electronics. Its surface-mount package and ROHS compliance make it suitable for IoT devices and renewable energy systems, with thermal performance optimized for continuous operation up to 85°C. Engineers should prioritize proper soldering techniques and verify inductance stability under operational conditions.
Reference Pricing
Reference Stock
Specifications
| Dimensions | OD (A): 16.59 mm, ID (B): 10.16 mm, HT (C): 6.35 mm |
| Inductance Value | Not provided |
| Loss | Not provided |
| Operating Temperature Range | Not provided |
| Package Type | - |
| Quality Factor | Not provided |
| Rated Voltage | Not provided |
Function And Role
Core Function
Magnetic component for signal filtering, power supply stabilization, and electromagnetic interference mitigation in electronic circuits
Key Characteristics
- ROHS compliant
- Surface Mount Technology (SMT) compatible packaging
- Material: ferrite core with enamel-coated wire
Application Domains
Basic Scenarios
- Consumer electronics (power adapters, USB chargers)
- Industrial motor control systems
- Telecommunications infrastructure
Extended Scenarios
- Renewable energy inverters
- Internet of Things (IoT) low-power devices
- Automotive electronic control units
Precautions
| Soldering | Use 60/40 rosin flux solder and avoid prolonged heat exposure (≤3 seconds per pad) |
| Current Limit | Max continuous current: 0.5A (Derate to 0.3A for high-temperature environments) |
| Voltage Limit | Operating voltage: 50V AC/DC (surge tolerance: 100V for 1ms) |
| Thermal Management | Thermal resistance: 85°C/W (mounting surface temperature should remain <90°C under continuous operation) |
| Storage | Store in anti-static bags at 15-25°C with <30% humidity |
| Risk Warnings |
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Alternative Model Params
- Inductance range (μH)
- Operating frequency range (kHz-MHz)
- Current derating curve
- Temperature coefficient (ppm/°C)
Design Recommendations
| Layout | Maintain ≥5mm trace spacing between adjacent windings |
| Thermal | Use thermal vias under the component in high-power designs |
| Compatibility | Verify with 0402/0603 pad layouts for SMT assembly |
| Testing | Perform inductance measurement after 24-hour soldering cycle |
Market Positioning
| Strengths |
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| Weaknesses |
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