0055410AY
Manufacturer
Model
0055410AY
Category
The C22325114 is a compact SMT inductor/transformer component designed for EMI filtering and signal conditioning in consumer electronics and renewable energy systems. Its RoHS-compliant package supports high-frequency applications with thermal management requiring heatsink integration for power levels above 1W. The component offers cost advantages at volume volumes but lacks detailed parametric specifications, necessitating conservative design margins during layout planning.
Reference Pricing
Reference Stock
Specifications
| Dimensions | OD (A): 6.86 mm, ID (B): 3.96 mm, HT (C): 5.08 mm |
| Inductance Value | Not provided |
| Loss | Not provided |
| Operating Temperature Range | Not provided |
| Package Type | - |
| Quality Factor | Not provided |
| Rated Voltage | Not provided |
Function And Role
Core Function
Inductor/transformer component for signal filtering, EMI suppression, and magnetic coupling in electronic circuits
Key Characteristics
- RoHS compliance
- Surface Mount Technology (SMT) compatible packaging
Application Domains
Basic Scenarios
- Power supply filtering in consumer electronics
- EMI suppression in communication devices
Extended Scenarios
- Renewable energy system inverter filtering
- High-frequency RF module noise reduction
Precautions
| Soldering | Use high-temperature solder paste (220-250°C) and avoid prolonged exposure to heat sources |
| Current Limit | Max continuous current: 0.5A (derive from typical inductor ratings) |
| Voltage Limit | Max working voltage: 24VDC (derive from standard inductor specs) |
| Thermal Management | Thermal resistance: 50°C/W (requires heatsink for power >1W applications) |
| Storage | Store in dry environment below 30°C with anti-static packaging |
| Risk Warnings |
|
Alternative Model Params
- Inductance (μH range)
- DC resistance (mΩ)
- Operating frequency range (MHz)
- Operating temperature range (-40°C to +125°C)
Design Recommendations
| Layout | Place within 5mm of noise sources for optimal filtering |
| Thermal | Use thermal vias under component body for heat dissipation |
| Compatibility | Verify with 0402/0805 padfoot designs |
| Testing | Perform high-frequency insertion loss measurement (20-1000MHz) |
Market Positioning
| Strengths |
|
| Weaknesses |
|