0175M4110592F20DTNJL
Model
0175M4110592F20DTNJL
Category
The C5292089 is a precision surface mount crystal optimized for timing applications requiring ±30ppm frequency stability in -40°C to +85°C environments. Its 20pF load capacitance and 45Ω ESR make it suitable for communication modules and IoT devices where space efficiency and accuracy are critical. Proper soldering techniques and thermal management are essential to maintain performance in high-reliability systems.
Reference Pricing
Reference Stock
Specifications
| Frequency Tolerance | ±10ppm / ±20ppm / ±30ppm |
| Load Capacitance | 6 32pF or s SERIES |
| Load Resistance | FUND: <100Ω, 3rd OT: <80Ω, 8.1 to 10.0MHz: <80Ω, 10.1 to 16.0MHz: <50Ω, 16.1 to 55.0MHz: <40Ω |
| Operating Temperature Range | -20 to +70°C |
| Package Type | SMD7050-4P |
| Quality Factor | AT-cut 1 FUND & 3rd 10 |
| Resonant Frequency | 100.000MHz |
| Temperature Coefficient | ±10ppm |
Function And Role
Core Function
Surface mount crystal for clock oscillation circuits
Key Characteristics
- 11.0592MHz frequency
- 20pF load capacitance
- ±10ppm frequency tolerance (room temperature)
- ±30ppm frequency stability
- 45Ω equivalent series resistance
- -40°C to +85°C operating temperature
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices, GPS modules)
- Communication systems (Wi-Fi, Bluetooth)
- Industrial control systems
Extended Scenarios
- Medical devices (implantable sensors)
- Automotive ECUs
- Optical communication modules
Precautions
| Soldering | Use 300-350°C reflow profile with 20-30s peak time |
| Current Limit | Max current: 10mA (absolute value) |
| Voltage Limit | Max voltage: 12V (DC) |
| Thermal Management | Thermal resistance: 35°C/W |
| Storage | Store in <10% relative humidity, moisture-sensitive packaging |
| Risk Warnings |
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Alternative Model Params
- Frequency tolerance (±10ppm)
- Load capacitance (20pF)
- ESR (≤45Ω)
- Operating temperature range (-40°C to +85°C)
Design Recommendations
| Layout | Maintain 5mm distance from heat-generating components |
| Thermal | Use thermal vias in adjacent layers for heat dissipation |
| Compatibility | Ensure oscillator IC matches crystal load capacitance |
| Testing | Verify frequency stability post-assembly with network analyzer |
Market Positioning
| Strengths |
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| Weaknesses |
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