0163M425000F20DTJJL
Model
0163M425000F20DTJJL
Category
The HCI 0163M425000F20DTJJL is a surface mount crystal optimized for precision timing applications. It delivers 25MHz frequency stability within ±30ppm tolerance, operates reliably between -40°C and +85°C, and features a 20pF load capacitance. Designed for compact PCB layouts, it is particularly suited for consumer electronics and industrial control systems. Proper soldering techniques and thermal management are critical to ensure long-term reliability.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | ±10ppm / ±20ppm / ±30ppm |
| Load Capacitance | 32pF or S Series, please specify |
| Load Resistance | FUND: 45Ω, 8.0MHz: 40Ω, 8.1 ~ 10.0MHz: ESR, 10.1 ~ 12.0MHz: 100Ω, 12.1 ~ 16.0MHz: 80Ω, 6~3: , 48.1 ~ 80.0MHz: |
| Operating Temperature Range | -20°C ~ +70°C |
| Package Type | SMD6035-4P |
| Quality Factor | FUND: 16.1Ω ~ 20.0Ω, 8.0MHz: 100Ω, 8.1 ~ 10.0MHz: 80Ω, 10.1 ~ 12.0MHz: U09, 12.1 ~ 16.0MHz: 50Ω, 6~3: , 48.1 ~ 80.0MHz: |
| Resonant Frequency | 8.000MHz ~ 80.000MHz |
| Temperature Coefficient | ±10ppm / ±15ppm |
Function And Role
Core Function
Provide precise clock signals for electronic circuits
Key Characteristics
- 25MHz frequency
- 20pF load capacitance
- ±30ppm frequency tolerance
- ±30ppm frequency stability
- 30Ω equivalent series resistance (ESR)
- -40°C to +85°C operating temperature range
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices, communication modules)
- Industrial control systems
Extended Scenarios
- Medical devices requiring high precision timing
- Automotive infotainment systems
Precautions
| Soldering | Use reflow soldering with 250-280°C peak temperature; avoid prolonged exposure |
| Current Limit | N/A |
| Voltage Limit | N/A |
| Thermal Management | Maintain within -40°C to +85°C operating range |
| Storage | Store in dry environments below 85°C; avoid static discharge |
| Risk Warnings |
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Alternative Model Params
- Frequency (25MHz)
- Load capacitance (20pF)
- Frequency tolerance (±30ppm)
- ESR (30Ω)
Design Recommendations
| Layout | Place away from heat generating components |
| Thermal | Use thermal vias for heat dissipation |
| Compatibility | Ensure SMD6035-4P footprint compatibility |
| Testing | Validate stability under extreme temperature cycling |
Market Positioning
| Strengths |
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| Weaknesses |
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