0153M4-24.000F10DTLLL
Model
0153M4-24.000F10DTLLL
Category
The 24MHz SMD crystal with 10pF load capacitance and ±20ppm tolerance is optimized for consumer electronics and IoT applications requiring precise timing. Its operating range up to +85°C and 30Ω ESR make it suitable for general-purpose use but limited in high-temperature industrial environments. Proper thermal management and anti-static handling are critical for maintaining performance.
Reference Pricing
Reference Stock
Specifications
Frequency Accuracy | ±10ppm |
Load Capacitance | 6~32pF |
Load Resistance | 50Ω |
Operating Temperature Range | -20°C to +70°C |
Package Type | SMD5032-4P |
Quality Factor | ±10ppm / ±20ppm / ±30ppm |
Resonant Frequency | 8.000MHz - 55.000MHz |
Temperature Coefficient | ±10ppm |
Function And Role
Core Function
Generate precise clock signals for timing applications
Key Characteristics
- 24MHz frequency
- 10pF load capacitance
- ±20ppm frequency tolerance
- ±20ppm frequency stability
- -40°C to +85°C operating temperature
- 30Ω equivalent series resistance
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices, communication modules)
- Industrial control systems
- Telecommunications equipment
Extended Scenarios
- Medical devices requiring precise timing
- Automotive infotainment systems
- GPS navigation modules
Precautions
Soldering | Use reflow soldering with peak temperatures not exceeding 250°C and avoid prolonged exposure to heat |
Current Limit | Max operating current 10mA (not specified in parameters) |
Voltage Limit | Operating voltage 2-3.6V (inferred from typical crystal specs) |
Thermal Management | Ensure proper heat dissipation with copper pours or thermal vias |
Storage | Store in anti-static packaging with <10% relative humidity |
Risk Warnings |
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Alternative Model Params
- Frequency (matching ±1MHz tolerance)
- Load capacitance (within ±5pF variation)
- Tolerance (±15ppm-±25ppm acceptable)
- Operating temperature range
Design Recommendations
Layout | Maintain 10mm trace length to crystal pins and use ground plane decoupling |
Thermal | Implement 10x10mm copper area around chip for heat dissipation |
Compatibility | Verify with 3.3V/5V logic families |
Testing | Perform frequency stability testing at extreme temperature limits |
Market Positioning
Strengths |
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Weaknesses |
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