0153G2-13.52127F20DTNJL
Model
0153G2-13.52127F20DTNJL
Category
The HCI 13.52127MHz SMD crystal offers robust frequency stability with ±10ppm tolerance at room temperature and ±30ppm stability across -40°C to +85°C, making it suitable for precision timing in communication modules and IoT devices. Key considerations include managing ESR in high-power circuits and ensuring proper thermal management in extended operating ranges.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | ±10ppm to ±50ppm |
| Load Capacitance | 6～ 32pF |
| Load Resistance | 60Ω |
| Operating Temperature Range | -20 to +70°C |
| Package Type | SMD5032 |
| Quality Factor | 80Ω |
| Resonant Frequency | 8.0～ 80.0MHz |
| Temperature Coefficient | ±10ppm |
Function And Role
Core Function
Provide precise frequency reference for electronic circuits
Key Characteristics
- 13.52127MHz frequency
- 20pF load capacitance
- ±10ppm frequency tolerance at room temperature
- ±30ppm frequency stability
- 50Ω equivalent series resistance (ESR)
- -40°C to +85°C operating temperature range
Application Domains
Basic Scenarios
- Communication modules (Wi-Fi, Bluetooth)
- RF circuits
- Clock generators
Extended Scenarios
- Medical devices requiring high precision timing
- IoT sensors with harsh environmental demands
- Military/aerospace applications
Precautions
| Soldering | Use high-temperature solder paste and avoid prolonged heat exposure to prevent component damage |
| Current Limit | Max operating current not specified (check datasheet) |
| Voltage Limit | Not specified (ensure operating conditions remain within absolute maximum ratings) |
| Thermal Management | Implement proper heat dissipation in high-power applications |
| Storage | Store in dry, cool environments away from static discharge risks |
| Risk Warnings |
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Alternative Model Params
- Frequency tolerance (±10ppm)
- Load capacitance (20pF)
- Operating temperature range (-40°C to +85°C)
- ESR (50Ω)
- Package type (SMD5032)
Design Recommendations
| Layout | Ensure 20pF load capacitor placement close to crystal pins |
| Thermal | Use thermal vias or copper pour for heat dissipation |
| Compatibility | Verify with RF IC manufacturers for frequency stability requirements |
| Testing | Perform aging tests under extreme temperature conditions |
Market Positioning
| Strengths |
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| Weaknesses |
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