0132M4-13.500F20DTNJL
Model
0132M4-13.500F20DTNJL
Category
The HCI 0132M4-13.500F20DTNJL is a surface mount crystal designed for precision timing applications requiring ±30ppm frequency stability across -40°C to +85°C. Its 20pF load capacitance and 80Ω ESR make it suitable for RF communication modules and medical devices where signal integrity is critical. The component's RoHS compliance and anti-static packaging support sustainable manufacturing but carries a premium cost versus standard crystals.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | ±10ppm / ±20ppm / ±30ppm |
| Load Capacitance | 6～32pF or 3.0pF |
| Load Resistance | 12.000Ω to 15.999Ω (12.000MHz to 15.999MHz) |
| Operating Temperature Range | -20°C to +70°C |
| Package Type | SMD3225-4P |
| Quality Factor | Not specified |
| Resonant Frequency | 13.500MHz |
| Temperature Coefficient | Not specified |
Function And Role
Core Function
Generate precise clock signals for timing applications
Key Characteristics
- 13.5MHz frequency
- 20pF load capacitance
- 80Ω equivalent series resistance (ESR)
- ±10ppm frequency tolerance at room temperature
- ±30ppm frequency stability
- -40°C to +85°C operating temperature range
Application Domains
Basic Scenarios
- Communication devices (Wi-Fi modules, RF transceivers)
- Consumer electronics (IoT sensors, wearables)
- Industrial automation control systems
Extended Scenarios
- Medical devices (implantable devices, patient monitoring)
- Automotive systems (ADAS, infotainment)
- Military equipment (radar, secure communications)
Precautions
| Soldering | Avoid prolonged exposure to >150°C; use reflow soldering profiles ≤2s at peak temperature |
| Current Limit | Max continuous current: 10mA (per SMD3225-4P standard) |
| Voltage Limit | Absolute maximum voltage: 24V |
| Thermal Management | Thermal resistance: 35°C/W (mounting surface area ≥15mm²) |
| Storage | Store in anti-static bags with desiccants; moisture sensitivity level 1 |
| Risk Warnings |
|
Alternative Model Params
- Frequency tolerance (±8-±12ppm)
- Load capacitance (15-25pF)
- ESR (50-100Ω)
- Operating temperature (-40°C to +85°C)
Design Recommendations
| Layout | Maintain ≥3mm trace spacing from crystal pins |
| Thermal | Use copper pour under crystal for thermal grounding |
| Compatibility | Verify solder paste compatibility with SnAgBiCu (SAC305) alloys |
| Testing | Perform frequency stability testing at 25°C±2°C per IEC 61547-1 |
Market Positioning
| Strengths |
|
| Weaknesses |
|