0132M4-13.4930F12DTNJK
Model
0132M4-13.4930F12DTNJK
Category
The C20554085 SMD crystal provides a stable 13.493MHz clock signal with ±30ppm frequency stability across -40°C to +85°C, optimized for surface mount designs in communication and industrial applications. Its 12pF load capacitance requires matching oscillator circuits, while proper thermal management ensures reliability in high-power environments. The RoHS-compliant component offers cost efficiency for mass production but lacks extended temperature grade options and frequency flexibility.
Reference Pricing
Reference Stock
Specifications
Frequency Accuracy | ±10ppm / ±20ppm / ±30ppm |
Load Capacitance | 6 ~ 32pF |
Load Resistance | 12.000 to 15.999Ω |
Operating Temperature Range | -20 to +70°C |
Package Type | SMD3225-4P |
Quality Factor | Not specified |
Resonant Frequency | 13.4930MHz |
Temperature Coefficient | Not specified |
Function And Role
Core Function
Generate precise clock signals for timing-critical applications
Key Characteristics
- 13.493MHz frequency with ±10ppm tolerance at 25°C
- ±30ppm frequency stability over operating range
- 12pF load capacitance
- SMD3225-4P surface mount packaging
- -40°C to +85°C operating temperature range
Application Domains
Basic Scenarios
- Wireless communication modules
- Industrial control systems
- Consumer electronics timing circuits
Extended Scenarios
- Medical device timing systems
- Automotive CAN bus interfaces
- Precision instrumentation modules
Precautions
Soldering | Use 0.2-0.3mm thick solder paste and 300-350°C reflow profile |
Current Limit | Max 5mA when driven by oscillator circuits |
Voltage Limit | Absolute maximum 3.3V working voltage |
Thermal Management | Thermal resistance 20°C/W, require heatsinks for >1W dissipation |
Storage | Store in antistatic bags below 10% RH and 25°C |
Risk Warnings |
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Alternative Model Params
- Frequency tolerance (ppm)
- Load capacitance (pF)
- Operating temperature range (°C)
- Packaging type (SMD/Through-hole)
- Packaging quantity per reel
Design Recommendations
Layout | Maintain 5mm trace length between crystal and oscillator |
Thermal | Use thermal vias under crystal pad for heat dissipation |
Compatibility | Verify oscillator drive strength matches crystal requirements |
Testing | Perform frequency stability testing at extreme temperature limits |
Market Positioning
Strengths |
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Weaknesses |
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