0121M4-16.000F09DTNLL
Model
0121M4-16.000F09DTNLL
Category
The 16MHz SMD2016-4P crystal (C20624148) provides ±10ppm frequency tolerance at 25°C with ±20ppm stability across -40°C to +85°C. Designed for precision timing in consumer electronics and communication modules, it features 9pF load capacitance and RoHS-compliant termination. Critical design parameters include solder profile control, thermal isolation from power components, and moisture resistance during assembly. Best suited for space-constrained applications requiring stable clock signals but limited to moderate temperature environments.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | ±10pm / ±20ppm / ±30ppm |
| Load Capacitance | 6 ~ 32pF |
| Load Resistance | 125Ω / 100Ω / 80Ω / U09 |
| Operating Temperature Range | -20 to +70°C |
| Package Type | SMD2016-4P |
| Quality Factor | ±15ppm |
| Resonant Frequency | 20.000 ～ 60.000MHz |
| Temperature Coefficient | ±15ppm |
Function And Role
Core Function
Clock signal generation
Key Characteristics
- 16MHz frequency
- 9pF load capacitance
- ±10ppm frequency tolerance (normal temperature)
- ±20ppm frequency stability
- Operating temperature range: -40°C to +85°C
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices)
- Communication modules (Wi-Fi/Bluetooth)
- Industrial control systems
Extended Scenarios
- Medical devices (implantable systems)
- Automotive ECUs
- Optical communication systems
Precautions
| Soldering | Use 300-350°C soldering temperature with 3-5s exposure time |
| Current Limit | Max 10mA continuous current |
| Voltage Limit | Max 12V operating voltage |
| Thermal Management | Maintain junction temperature <85°C during operation |
| Storage | Store in <10% relative humidity environment |
| Risk Warnings |
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Alternative Model Params
- Frequency tolerance (ppm)
- Load capacitance (pF)
- Operating temperature range
- Package dimensions (SMD2016-4P)
Design Recommendations
| Layout | Maintain 5mm distance from heat-generating components |
| Thermal | Use 1.6mm thick copper pour for heat dissipation |
| Compatibility | Verify with 0805/0603 equivalent crystalfootprints |
| Testing | Perform 100% AOI inspection for solder joint integrity |
Market Positioning
| Strengths |
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| Weaknesses |
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