01.X.MD.120JJVF0028636360
Manufacturer
Model
01.X.MD.120JJVF0028636360
Category
The C7570483 is a 28.63636MHz SMD crystal optimized for timing-critical applications with ±20ppm tolerance and 20pF load capacitance. It supports consumer electronics and industrial devices at -40°C to +85°C but lacks extended temperature options. Proper reflow soldering and thermal management are essential for reliability. Current pricing offers competitive rates for volume buyers while maintaining ROHS compliance.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | 10ppm - 30ppm |
| Load Capacitance | 8pF - 10pF |
| Load Resistance | Not provided |
| Operating Temperature Range | -40℃ - 125℃ |
| Package Type | SMD3225-4P |
| Quality Factor | Not provided |
| Resonant Frequency | 8MHz - 54MHz |
| Temperature Coefficient | Not provided |
Function And Role
Core Function
Generate precise clock signals for timing applications
Key Characteristics
- 28.63636MHz frequency
- 20pF load capacitance
- ±20ppm frequency tolerance
- SMD3225-4P surface mount package
Application Domains
Basic Scenarios
- Communication devices (modems, routers)
- Consumer electronics (wearables, IoT)
- Industrial control systems
Extended Scenarios
- Medical devices (implants, monitors)
- Automotive telematics
- High-precision measurement equipment
Precautions
| Soldering | Use reflow soldering with 220-240°C peak temperature and 20-30s peak time to avoid package damage |
| Storage | Store in anti-static bags at 10-40°C with <10% RH |
| Current Limit | N/A (crystal not designed for direct current handling) |
| Voltage Limit | N/A (voltage not specified in parameters) |
| Thermal Management | Max operating temperature +85°C, derate to 70% at +105°C |
| Risk Warnings |
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Alternative Model Params
- Frequency tolerance (ppm)
- Load capacitance (pF)
- Package dimensions (mm)
- Operating temperature range
Design Recommendations
| Testing | Perform frequency stability testing at -40°C to +85°C |
| Layout | Keep crystal trace length <10mm and ground plane adjacent to package |
| Thermal | Use thermal vias under package for heat dissipation |
| Compatibility | Verify with 3.3V/5V logic families |
Market Positioning
| Strengths |
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| Weaknesses |
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