016402
Manufacturer
Model
016402
Category
This embedded development kit is designed for industrial IoT and automation applications, offering modular expansion capabilities with preloaded tools for hardware verification and system prototyping. Its ROHS compliance and industrial-grade thermal management make it suitable for extended operating environments, though initial cost and processor compatibility requirements may influence deployment decisions.
Reference Pricing
Reference Stock
Specifications
| Dimensions | 70 × 70 mm |
| Expansion Interfaces | 4x USB 2.0, 1x USB 3.0, 1x SDIO 3.0, 1x SATA 6 Gbit/s, 2x PCIe 3.0, I2C Bus, SPI |
| Memory Capacity | 4GB LPDDR4 Memory |
| Operating System Support | Linux, Yocto Linux, Android |
| Operating Temperature Range | 0 to +60°℃ (Commercial Grade), -40 to +85°℃ (Industrial Grade) |
| Power Consumption | Typ. application 5-15W |
| Processor Type | NXP i.MX 8QuadMax Processor |
| Rated Voltage | 5V |
| Storage Capacity | 16GB eMMC |
| Weight | Not specified |
Function And Role
Core Function
Development boards and kits for embedded computing systems
Key Characteristics
- ROHS compliant
- Supports modular expansion
- Preloaded with development tools
Application Domains
Basic Scenarios
- Prototype design
- Embedded system development
- Hardware function verification
Extended Scenarios
- Industrial automation control
- Edge computing node deployment
- Internet of Things device prototype iteration
Precautions
| Soldering | Maximum soldering temperature: 260°C, 10-15 seconds per pad |
| Current Limit | Max continuous current: 2A (excluding power input) |
| Voltage Limit | Operating voltage: 3.3V-5V DC |
| Thermal Management | Recommended thermal pad pressure: 10-15 N/cm² |
| Storage | Relative humidity: 10%-90% (non-condensing) |
| Risk Warnings |
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Alternative Model Params
- Form factor (size: 50.8x101.6mm)
- Supports processor interfaces (Intel Atom/Celeron)
- Power consumption (<5W)
Design Recommendations
| Layout | Prioritize the layout of heat-generating components close to the heat dissipation holes |
| Thermal | It is recommended to install thermal grease to enhance thermal conduction efficiency |
| Compatibility | Ensure compatibility with Congatec AG 9860 series processors |
| Testing | At least 72 hours of continuous operation pressure test is required |
Market Positioning
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| Weaknesses |
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