015512
Manufacturer
Model
015512
Category
The C22183704 development board is optimized for industrial embedded systems requiring robust prototyping and compliance with environmental regulations. Its modular design supports IoT, edge computing, and AI/ML validation through preconfigured interfaces and thermal management features, though extended use cases may require additional thermal solutions and interface expansions.
Reference Pricing
Reference Stock
Specifications
| Dimensions | 70 × 70 mm |
| Expansion Interfaces | 3x PCIe Gen2 | 1x USB 3.0/2.0 | 5x USB 2.0 | 2x SATA3 | SDv3 | LPC Bus | SMBus | I2C Bus | UART |
| Memory Capacity | 2GB 1866MT/s DDR3L onboard memory |
| Operating System Support | Microsoft Windows 10 IoT Enterprise | Microsoft Windows 10 IoT Core | Microsoft Windows 10 | Linux | Yocto |
| Operating Temperature Range | Industrial: Operating temperature -40°C to +85°C, Storage temperature -40°C to +85°C |
| Power Consumption | Typical power consumption 6W...12W |
| Processor Type | Intel Atom TM x5-E3930 dual-core processor |
| Rated Voltage | No specific rated voltage information provided |
| Storage Capacity | 8GB eMMC onboard flash |
| Weight | No specific weight information provided |
Function And Role
Core Function
Development boards and kits for embedded system prototyping and hardware testing
Key Characteristics
- ROHS compliance
- Support for industrial-grade applications
- Preconfigured software stack
- Modular expansion capabilities
Application Domains
Basic Scenarios
- Embedded system prototyping
- IoT device development
- Industrial automation testing
Extended Scenarios
- AI/ML hardware integration
- Edge computing deployment
- Ruggedized environment validation
Precautions
| Soldering | Use low-temperature soldering (≤300°C) and grounded tools to prevent board damage |
| Current Limit | Max continuous current: 2A (per power rail) |
| Voltage Limit | Operating voltage: 12-24VDC (with 5VDC logic tolerance) |
| Thermal Management | Thermal resistance: 50°C/W at ambient 25°C; require heatsinks for >1W continuous load |
| Storage | Store in controlled environment (15-25°C, <30% RH) with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Processing power (CPU/GPU)
- Memory capacity
- Interface connectors (USB/PCIe)
- Operating temperature range
Design Recommendations
| Layout | Ensure 10mm clearance between high-frequency traces and power lines |
| Thermal | Implement copper pours for heat dissipation >1W components |
| Compatibility | Verify OS/driver support for target application ecosystems |
| Testing | Conduct EMI/EMC testing before final deployment |
Market Positioning
| Strengths |
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| Weaknesses |
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