0.5-8P XJH2.0 043
Manufacturer
Model
0.5-8P XJH2.0 043
Category
The SHOU HAN 0.5-8P XJH2.0 043 surface mount connector is a cost-effective solution for flexible interconnect applications requiring 8P connections with 0.5mm pitch, designed for consumer electronics and automotive systems. Its flip type design and bottom contact configuration ensure reliable surface mount assembly, while the tin-plated brass contacts provide corrosion resistance. The connector operates within -55°C to +85°C, making it suitable for harsh environments. Engineers should prioritize proper solder profile control and verify thermal management in high-cycle applications.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R0.5mm |
| Contact Resistance | ≤100 mΩ |
| Dimensions | According to specific model |
| Insulation Resistance | ≥500MΩ |
| Material | Main body: LCP UL 94V-0; Housing lock, terminal, contact: Phosphor Bronze |
| Number of Contact Pairs | 8 |
| Number of Insertion and Extraction Cycles | ≥10000 times |
| Operating Temperature Range | -55℃ ~ +85℃ |
| Operating Voltage | AC/DC (RMS) 50Hz |
| Pitch | 2.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
Connecting flexible circuits (FFC/FPC) to rigid boards in surface mount applications
Key Characteristics
- Flip type design
- 8P contacts
- 0.5mm pitch
- Surface Mount (SMD)
- Bottom Contact
- Tin-plated contacts
Application Domains
Basic Scenarios
- Consumer electronics (terminals, displays)
- Automotive interior systems
Extended Scenarios
- Medical devices with flexible interfaces
- IoT devices requiring space-efficient connectors
Precautions
| Soldering | Use reflow soldering with <240°C peak temperature; avoid prolonged exposure |
| Current Limit | Max current not specified (check datasheet for exact limits) |
| Voltage Limit | Operating voltage not specified (ensure compatibility with system requirements) |
| Thermal Management | Max operating temperature 85°C; derate to 70°C for continuous operation |
| Storage | Store in dry, cool environments (<30°C) with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.5mm required)
- Contact count (8P mandatory)
- Plating type (Tin preferred)
- Mounting style (Surface Mount required)
Design Recommendations
| Layout | Ensure 2mm minimum board clearance above connector body |
| Thermal | Implement copper pour heat sinking for high-cycle applications |
| Compatibility | Verify FFC/FPC thickness (0.3mm) matches target materials |
| Testing | Perform bend endurance testing per IEC 61032-4 for flexible applications |
Market Positioning
| Strengths |
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| Weaknesses |
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