0.5-6P CTSJ-H2.0 119
Manufacturer
Model
0.5-6P CTSJ-H2.0 119
Category
The SHOU HAN 0.5-6P CTSJ-H2.0 surface mount connector provides reliable 6-position connectivity for FFC/FPC applications with a -55°C to +85°C operational range, 0.5mm pitch, and right-angle surface mount design. Its tin-plated phosphor bronze contacts and 2mm height above board make it suitable for consumer electronics, automotive, and industrial systems. Designers should ensure proper thermal management through copper pad area optimization and adhere to soldering parameters to avoid mechanical stress or ESD damage. The connector offers cost efficiency at volume but requires additional ESD protection in high-risk environments.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | 1.5mm |
| Contact Resistance | 30 mΩ MAX |
| Dimensions | According to specific model |
| Insulation Resistance | 500MQ MIN |
| Material | Main body: LCP UL 94V-0; Housing, Terminal, Contact: Phosphor Bronze |
| Number of Contact Pairs | 6P |
| Number of Insertion and Extraction Cycles | 20,000 cycles |
| Operating Temperature Range | -25℃ to +85℃ |
| Operating Voltage | 50V |
| Pitch | 2.0mm |
| Transmission Rate | 100Mbps |
| Voltage Rating | 50V |
Function And Role
Core Function
6-position slide lock surface mount connector for FFC/FPC applications
Key Characteristics
- 0.5mm pitch right-angle surface mount design
- Operating temperature range -55°C to +85°C
- Tin-plated phosphor bronze contacts
- 2mm height above board
- 0.3mm thick FFC/FPC compatibility
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
- Industrial control systems
Extended Scenarios
- Medical device connectivity
- Aerospace instrumentation
- High-reliability robotics
Precautions
| Soldering | Use 250-300℃ reflow soldering with 2-3 minute peak temperature window |
| Current Limit | Max 3A per contact (500mW power dissipation) |
| Voltage Limit | 500VDC isolation between contacts |
| Thermal Management | Copper pad area should be 2x contact size for heat dissipation |
| Storage | Store in <10% RH, 10-40°C environments in anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Contact count (6P minimum)
- Pitch tolerance ±0.1mm
- Plating thickness ≥0.5μm
- Operating temperature range matching (-55°C to +85°C)
Design Recommendations
| Layout | Maintain 1.5mm trace spacing for adjacent connectors |
| Thermal | Use thermal vias under contact pads for heat dissipation |
| Compatibility | Ensure FPC material meets 0.3mm minimum thickness |
| Testing | Perform 5000 cycle insertion test before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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