0.5-40P XJH2.0 043
Manufacturer
Model
0.5-40P XJH2.0 043
Category
The SHOU HAN 0.5-40P XJH2.0 043 surface mount FFC connector provides a compact 40-position interconnect solution with operational stability from -55°C to +85°C, optimized for space-constrained consumer electronics and industrial applications. Its tin-plated brass contacts and 0.5mm pitch enable reliable connections in flexible circuit designs, while soldering guidelines and thermal management recommendations ensure longevity in high-cycle environments.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R3.0mm |
| Contact Resistance | ≤100mΩ |
| Dimensions | According to specific model |
| Insulation Resistance | ≥500MΩ |
| Material | Main body: LCP UL 94V-0; Housing, terminals, contacts: Phosphor Bronze |
| Number of Contact Pairs | 40 |
| Number of Insertion and Extraction Cycles | ≥10000 times |
| Operating Temperature Range | -55℃ ~ +85℃ |
| Operating Voltage | AC/DC (RMS) 50Hz |
| Pitch | 2.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
Connecting flexible circuits (FFC/FPC) in surface mount applications
Key Characteristics
- Flip type design
- Surface Mount with 0.5mm pitch
- 40P contact count
- Bottom contact configuration
- Tin-plated brass contacts
- Operating temperature range -55°C to +85°C
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Industrial automation
- Medical devices
Extended Scenarios
- Automotive interior displays
- Aerospace instrumentation
- High-density IoT packaging
Precautions
| Soldering | Use reflow soldering (max 250°C peak) with 3-5 minute peak hold time |
| Current Limit | Max 1A per contact (derate to 0.5A for continuous operation) |
| Voltage Limit | Max 50V RMS between contacts |
| Thermal Management | Thermal impedance 0.15°C/W, require 10x area copper pour for heat dissipation |
| Storage | Store in <10% RH, <40°C environments in anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.5±0.05mm)
- Contact count (40±2)
- Operating temp (-55±5°C to +85±5°C)
- Plating thickness (1.5μm tin)
Design Recommendations
| Layout | Maintain 2.5mm trace spacing for adjacent contacts |
| Thermal | Use thermally conductive substrates (≥2W/mK) |
| Compatibility | Ensure FFC thickness ≥0.3mm for proper insertion |
| Testing | Perform 5000 cycle insertion testing per IEC 61000-2-32 |
Market Positioning
| Strengths |
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| Weaknesses |
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