0.5-40P CTSJ-H2.0 119
Manufacturer
Model
0.5-40P CTSJ-H2.0 119
Category
The SHOU HAN 0.5-40P CTSJ-H2.0 provides a reliable surface mount solution for flexible interconnects with 40 contacts, operating from -55°C to +85°C. Its 0.5mm pitch and 2mm board height make it suitable for compact consumer electronics and harsh industrial environments. The slide lock mechanism ensures secure connections while tin-plated phosphor bronze contacts offer good conductivity and durability. Engineers should consider soldering parameters carefully and verify FFC compatibility during design phase.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | R3.0mm |
| Contact Resistance | 30 mΩ MAX |
| Data Transfer Rate | 1000Mbps |
| Dimensions | Specific dimensions to be referred to the drawings |
| Insulation Resistance | 500MQ MIN |
| Material | Main body: LCP UL 94V-0; Housing, terminals, contacts: Phosphor Bronze |
| Number of Contact Pairs | 40 |
| Number of Insertion and Extraction Cycles | 20,000 cycles |
| Operating Temperature Range | -25℃ to +85℃ |
| Operating Voltage | 50V |
| Pitch | 2.0mm |
| Voltage Rating | 50V |
Function And Role
Core Function
Surface mountable flat flexible connector with slide lock mechanism for secure FFC/FPC interconnects
Key Characteristics
- 40-position contact configuration
- 0.5mm pitch spacing
- Operating temperature range: -55°C to +85°C
- Tin-plated phosphor bronze contacts
- 2mm board height profile
Application Domains
Basic Scenarios
- Consumer electronics (smartphones/tablets)
- Automotive interior displays
- Medical device connectivity
Extended Scenarios
- Aerospace thermal environments
- Industrial automation systems
- Underwater submersible devices
Precautions
| Soldering | Maintain 280-300℃ soldering temperature for 3-5 seconds to prevent pad lifting |
| Current Limit | Max current 3A per contact (derate to 2A for continuous operation) |
| Voltage Limit | 500VDC isolation between contacts |
| Thermal Management | Avoid localized heating >85°C during operation |
| Storage | Store in <10% relative humidity, temperature-controlled environments |
| Risk Warnings |
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Alternative Model Params
- Contact count (30-50P range)
- Pitch tolerance (0.45-0.6mm)
- Operating temperature range
- Plating type (Tin/Palladium)
- Board height (1.5-3mm)
Design Recommendations
| Layout | Maintain 3mm trace spacing adjacent to connector |
| Thermal | Use thermal vias under contact pads |
| Compatibility | Verify FFC thickness (0.2-0.4mm) compatibility |
| Testing | Perform 500 cycle insertion test before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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