0.5-24P XJH2.0 043
Manufacturer
Model
0.5-24P XJH2.0 043
Category
The SHOU HAN 0.5-24P XJH2.0 043 surface mount connector features a flip-type locking mechanism, 24 bottom contact positions with 0.5mm pitch, and operates reliably between -55°C and +85°C. Designed for FFC/FPC interconnects in consumer electronics, automotive, and medical devices, it offers tin-plated brass contacts for good conductivity and durability. Soldering requires controlled temperature and time to prevent mechanical failure, while thermal management should consider the 0.15°C/W impedance. Alternative models match pitch, contact material, and temperature specs, but design engineers should prioritize proper layout spacing and thermal vias in high-stress environments.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R3.0mm |
| Contact Resistance | ≤100mΩ |
| Dimensions | According to specific model |
| Insulation Resistance | ≥500MΩ |
| Material | Main body:LCP UL 94V-0; Housing Lock:LCP UL 94V-0; Terminal:Phosphor Bronze; Contact:Phosphor Bronze |
| Number of Contact Pairs | 24 |
| Number of Insertion and Extraction Cycles | ≥10000 times |
| Operating Temperature Range | -55℃ ~ +85℃ |
| Operating Voltage | AC/DC(Voltage RMS)50Hz |
| Pitch | 2.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
Surface mountable flat flexible connector for interconnecting FFC/FPC with boards
Key Characteristics
- Flip type locking mechanism
- 24-position bottom contact design
- 0.5mm pitch spacing
- Operating temperature range -55°C to +85°C
- Brass contact material with tin plating
- 2mm height above board
Application Domains
Basic Scenarios
- Consumer electronics assembly
- Automotive interior displays
- Medical device connectivity
Extended Scenarios
- Aerospace instrumentation systems
- Industrial automation equipment
- wearable technology interfaces
Precautions
| Soldering | Maintain 300-350°C soldering temperature for 3-5 seconds to avoid pad lifting |
| Current Limit | Max continuous current 3A per contact |
| Voltage Limit | Operating voltage up to 50VDC |
| Thermal Management | Thermal impedance 0.15°C/W |
| Storage | Store in antistatic packaging below 30°C in dry environment |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.5mm standard)
- Contact material (Brass/Tin-plated)
- Operating temperature range
- Number of positions (24P standard)
Design Recommendations
| Layout | Ensure 3mm clearance around connector footprint |
| Thermal | Use thermal vias for heat dissipation in high-power applications |
| Compatibility | Verify FFC thickness (0.3mm) matches cable specification |
| Testing | Perform bend endurance testing per IEC 61032-3 |
Market Positioning
| Strengths |
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| Weaknesses |
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