0.5-24P CTSJ-H2.0 119
Manufacturer
Model
0.5-24P CTSJ-H2.0 119
Category
This 24-position surface mount FFC/FPC connector features a slide lock mechanism for secure connections, operates reliably across -55℃ to +85℃ industrial temperature ranges, and offers cost-effective solutions for consumer and automotive electronics. Its 0.5mm pitch and phosphor bronze contacts ensure precision interconnect performance while maintaining competitive pricing through optimized manufacturing processes.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R0.6mm |
| Contact Resistance | 30mΩ Max |
| Dimensions | As per specific model |
| Insertion/Extraction Cycles | 20,000 cycles |
| Insulation Resistance | 500MΩ Min |
| Material | As per specific model |
| Number of Contact Pairs | 24 |
| Operating Temperature Range | 25℃~+85℃ |
| Operating Voltage | 50VAC/DC |
| Pitch | 2.0mm |
| Transmission Rate | 0.5Gbps |
| Voltage Rating | 50VAC/DC |
Function And Role
Core Function
Slide lock connector for FFC/FPC assemblies with 24 contacts, surface mount design, and phosphor bronze contacts
Key Characteristics
- Slide Lock mechanism
- Operating temperature -55℃~+85℃
- 0.5mm pitch
- Right angle surface mount
- Tin-plated contacts
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
- Medical device connectivity
Extended Scenarios
- Aerospace instrumentation
- Industrial automation control panels
- Ruggedized field equipment
Precautions
| Soldering | Use reflow soldering with max 240℃ peak temperature, 20-30 seconds per pad |
| Current Limit | Max 1A per contact (recommended continuous current <0.5A for reliability) |
| Voltage Limit | Max 50V DC |
| Thermal Management | Thermal impedance 50℃/W, require 10x10mm copper pour for heat dissipation |
| Storage | Store in anti-static bags at 10-40℃ with 30-60% RH |
| Risk Warnings |
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Alternative Model Params
- Contact count (16-32P)
- Pitch (0.3-1.0mm)
- Operating temperature range
- Plating type (Tin/Nickel)
- Mounting orientation
Design Recommendations
| Layout | Maintain 2.5mm trace spacing, use 0.1mm clearance for FPC insertion |
| Thermal | Implement thermal vias under contact pads, use 4-layer PCB with 2oz copper |
| Compatibility | Verify FFC/FPC thickness (0.15-0.3mm) before assembly |
| Testing | Perform 5000 insertion/extraction cycles and 1000 hours high temperature aging test |
Market Positioning
| Strengths |
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| Weaknesses |
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