0.5-22P XJH2.0 043
Manufacturer
Model
0.5-22P XJH2.0 043
Category
The SHOU HAN 0.5-22P XJH2.0 043 surface mount FPC connector offers a flip-type design with 22 brass contacts (0.5mm pitch) suitable for -55°C to +85°C environments. Ideal for compact consumer and automotive applications requiring flexible interconnects, it features tin-plated contacts for reliable soldering and 50VDC voltage tolerance. Critical design parameters include proper thermal management and FPC thickness compatibility. While cost-competitive and RoHS-compliant, extended lifecycle certifications and brand awareness remain areas for improvement.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R3.0mm |
| Contact Resistance | ≤100mΩ |
| Dimensions | Specific dimensions need to be referred to the drawings |
| Insulation Resistance | ≥500MΩ |
| Material | Main body: LCP UL 94V-0; Housing, terminal, contact: Phosphor Bronze |
| Number of Contact Pairs | 22 |
| Number of Insertion and Extraction Cycles | ≥10000 times |
| Operating Temperature Range | -55℃ ~ +85℃ |
| Operating Voltage | AC/DC (RMS) 50Hz |
| Pitch | 2.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
Provide reliable connectivity for flexible circuits in surface mount applications
Key Characteristics
- Flip type design
- 22 contact points
- 0.5mm pitch
- Surface Mount (SMD) with right angle orientation
- Brass contacts with tin plating
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
Extended Scenarios
- Medical device interfaces
- Industrial automation control panels
Precautions
| Soldering | Use fine tip iron (300-350°C) and avoid prolonged heating |
| Current Limit | Max 1A per contact |
| Voltage Limit | Max 50VDC |
| Thermal Management | Thermal pad recommended for heat dissipation |
| Storage | Store in <10% RH, static-free environment |
| Risk Warnings |
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Alternative Model Params
- Contact count (20-24P)
- Pitch (0.4-0.6mm)
- Plating type (tin/palladium)
- Operating temperature range
Design Recommendations
| Layout | Ensure 2mm minimum board clearance above connector |
| Thermal | Add 10-15% thermal relief in PCB trace |
| Compatibility | Verify FPC thickness (0.3mm max) with connector slot |
| Testing | Perform high-cycle fatigue testing (>10^6 cycles) |
Market Positioning
| Strengths |
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| Weaknesses |
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