0.5-22P CTXJ-H2.0 119
Manufacturer
Model
0.5-22P CTXJ-H2.0 119
Category
The SHOU HAN 0.5-22P CTXJ-H2.0 surface mount FFC connector provides reliable interconnect solutions for high-temperature environments with its slide lock mechanism, 22-pin density, and tin-plated phosphor bronze contacts. Optimized for consumer electronics, automotive, and industrial automation applications, it offers cost-effective connectivity with 0.5mm pitch and -55°C to +85°C operational range. Designers should prioritize thermal management through copper pours and verify FFC thickness compatibility to ensure long-term reliability.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | R3.0mm |
| Contact Resistance | 30 mΩ MAX |
| Dimensions | Specific dimensions to be referred to the drawings |
| Insulation Resistance | 500MQMIN |
| Material | Main body: LCP UL 94V-0; Housing, terminals, contacts: Phosphor Bronze |
| Number of Contact Pairs | 22 |
| Number of Insertion and Extraction Cycles | 20,000 cycles |
| Operating Temperature Range | -25℃ to +85℃ |
| Operating Voltage | 50V |
| Pitch | 0.5mm |
| Transmission Rate | 1000Mbps |
| Voltage Rating | 50V |
Function And Role
Core Function
Connecting Flat Flexible Cables (FFC/FPC) to printed circuit boards (PCB) in surface mount applications
Key Characteristics
- Slide Lock mechanism for secure cable retention
- 22-pin configuration with 0.5mm pitch
- Bottom contact design for reliable signal transmission
- Operating temperature range of -55°C to +85°C
- Tin-plated phosphor bronze contacts for corrosion resistance
Application Domains
Basic Scenarios
- Consumer electronics (IoT devices, wearables)
- Automotive interior displays
- Medical devices requiring flexible cabling
Extended Scenarios
- Industrial automation with harsh environmental conditions
- Aerospace applications requiring extended temperature tolerance
- Telecommunications equipment with space-constrained layouts
Precautions
| Soldering | Use 300-350°C soldering iron with 0.2-0.3mm diameter tip; avoid prolonged heat exposure |
| Current Limit | Max continuous current: 0.5A (per industry standard for FFC connectors) |
| Voltage Limit | Max voltage rating: 50V DC (based on phosphor bronze contact rating) |
| Thermal Management | Thermal resistance: 0.3°C/W (requires PCB copper pour >10mm width for heat dissipation) |
| Storage | Store in <10% relative humidity, <40°C environment; avoid static discharge areas |
| Risk Warnings |
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Alternative Model Params
- Pitch matching (0.5mm tolerance ±0.05mm)
- Contact material compatibility (phosphor bronze vs. beryllium copper)
- Operating temperature range alignment (-40°C to +100°C variants available)
- Plating thickness (1.5μm tin vs. 2μm gold options)
Design Recommendations
| Layout | Maintain 3x pin spacing for reflow soldering; use 0.1mm clearances from adjacent components |
| Thermal | Implement 10mil copper pour under connector area; consider thermal vias for >5000 pieces/minute production |
| Compatibility | Verify FFC thickness (0.3±0.05mm) matches connector clamping force (8-12N) |
| Testing | Perform 5000 cycle insertion test (10N force) and 1000H contact resistance test |
Market Positioning
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| Weaknesses |
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