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0.5-20P CTSJ-H2.0 119

Manufacturer

Shou Han

Model

0.5-20P CTSJ-H2.0 119

Category

connectors
wire_to_board

This surface mount FFC/FPC connector provides reliable interconnect solutions for extreme temperature environments with 20 contacts, 0.5mm pitch, and slide lock retention. Ideal for automotive, aerospace, and industrial applications requiring flexible, high-reliability connections within -55°C to +85°C operating ranges. Its tin-plated phosphor bronze contacts ensure durability with proper soldering techniques and thermal management.

Reference Pricing

5+ :$0.0742
50+ :$0.0602
150+ :$0.0546
500+ :$0.0504
2000+ :$0.049
4000+ :$0.0406

Reference Stock

Available:3730

Specifications

Bend RadiusR3.0mm
Contact Resistance30 mΩ MAX
DimensionsAccording to specific model
Insulation Resistance500MQMIN
MaterialMain body: LCP UL 94V-0, Housing Lock: LCP UL 94V-0, Terminal: Phosphor Bronze, Contact: Phosphor Bronze
Number of Contact Pairs20
Number of Insertion and Extraction Cycles20,000 cycles
Operating Temperature Range-25℃ to +85℃
Operating Voltage50V
Pitch2.0mm
Transmission Rate1000Mbps
Voltage Rating50V

Function And Role

Core Function

Connecting flexible circuits (FFC/FPC) in surface mount applications

Key Characteristics

  • Slide Lock mechanism for secure retention
  • Operating temperature range: -55°C to +85°C
  • 20 contacts with 0.5mm pitch
  • Tin-plated phosphor bronze contacts
  • Surface mount (SMD) design with 2mm height above board

Application Domains

Basic Scenarios

  • Consumer electronics (wearables, IoT devices)
  • Medical devices requiring flexible interconnects
  • Automotive interior dashboards

Extended Scenarios

  • Aerospace applications with harsh thermal environments
  • Industrial automation systems requiring durability
  • Telecom equipment with extended operating ranges

Precautions

Soldering

Use reflow soldering with max 250°C peak temperature, avoid prolonged exposure

Current Limit

Max 1A per contact (200mA continuous)

Voltage Limit

Operating voltage up to 30VDC

Thermal Management

Thermal impedance: 3.5W/mK, require proper copper pour for heat dissipation

Storage

Store in anti-static packaging below 10% RH, max 85°C

Risk Warnings
  • Static discharge can damage contacts
  • Exceed 30VDC may cause signal degradation
  • Avoid mechanical stress beyond 50N contact retention force

Alternative Model Params

  • Contact count (16-24P range)
  • Pitch tolerance (0.4-0.6mm acceptance)
  • Operating temperature (-40°C to +105°C equivalent)
  • Plating type (ENIG or gold optional)

Design Recommendations

Layout

Maintain 3mm trace spacing for adjacent contacts

Thermal

Use thermal vias under high current paths

Compatibility

Validate with 0.3mm thick FFC/FPC materials

Testing

Perform 500 cycle insertion test per MIL-STD-882E

Market Positioning

Strengths
  • Cost-effective alternative to premium connectors
  • Wide industrial temperature compliance
  • High contact retention (5000 cycles min)
Weaknesses
  • Limited to 0.5mm pitch applications
  • No built-in ESD protection
  • Smaller than 24P competitors

Datasheet

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