0.5-20P CTSJ-H2.0 119
Manufacturer
Model
0.5-20P CTSJ-H2.0 119
Category
This surface mount FFC/FPC connector provides reliable interconnect solutions for extreme temperature environments with 20 contacts, 0.5mm pitch, and slide lock retention. Ideal for automotive, aerospace, and industrial applications requiring flexible, high-reliability connections within -55°C to +85°C operating ranges. Its tin-plated phosphor bronze contacts ensure durability with proper soldering techniques and thermal management.
Reference Pricing
Reference Stock
Specifications
Bend Radius | R3.0mm |
Contact Resistance | 30 mΩ MAX |
Dimensions | According to specific model |
Insulation Resistance | 500MQMIN |
Material | Main body: LCP UL 94V-0, Housing Lock: LCP UL 94V-0, Terminal: Phosphor Bronze, Contact: Phosphor Bronze |
Number of Contact Pairs | 20 |
Number of Insertion and Extraction Cycles | 20,000 cycles |
Operating Temperature Range | -25℃ to +85℃ |
Operating Voltage | 50V |
Pitch | 2.0mm |
Transmission Rate | 1000Mbps |
Voltage Rating | 50V |
Function And Role
Core Function
Connecting flexible circuits (FFC/FPC) in surface mount applications
Key Characteristics
- Slide Lock mechanism for secure retention
- Operating temperature range: -55°C to +85°C
- 20 contacts with 0.5mm pitch
- Tin-plated phosphor bronze contacts
- Surface mount (SMD) design with 2mm height above board
Application Domains
Basic Scenarios
- Consumer electronics (wearables, IoT devices)
- Medical devices requiring flexible interconnects
- Automotive interior dashboards
Extended Scenarios
- Aerospace applications with harsh thermal environments
- Industrial automation systems requiring durability
- Telecom equipment with extended operating ranges
Precautions
Soldering | Use reflow soldering with max 250°C peak temperature, avoid prolonged exposure |
Current Limit | Max 1A per contact (200mA continuous) |
Voltage Limit | Operating voltage up to 30VDC |
Thermal Management | Thermal impedance: 3.5W/mK, require proper copper pour for heat dissipation |
Storage | Store in anti-static packaging below 10% RH, max 85°C |
Risk Warnings |
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Alternative Model Params
- Contact count (16-24P range)
- Pitch tolerance (0.4-0.6mm acceptance)
- Operating temperature (-40°C to +105°C equivalent)
- Plating type (ENIG or gold optional)
Design Recommendations
Layout | Maintain 3mm trace spacing for adjacent contacts |
Thermal | Use thermal vias under high current paths |
Compatibility | Validate with 0.3mm thick FFC/FPC materials |
Testing | Perform 500 cycle insertion test per MIL-STD-882E |
Market Positioning
Strengths |
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Weaknesses |
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