0.5-14P CTXJ-H2.0 119
Manufacturer
Model
0.5-14P CTXJ-H2.0 119
Category
The SHOU HAN 0.5-14P CTXJ-H2.0 is a high-reliability SMD FFC/FPC connector with slide lock mechanism, optimized for extreme temperature applications in consumer electronics and automotive markets. Its 14-pin bottom contact design and 0.5mm pitch provide compact solutions for space-constrained devices, while the phosphor bronze contacts ensure durability in high-cycle environments. The component requires precise thermal management during assembly and is best suited for applications requiring secure, vibration-resistant connections in operating temperatures as low as -55°C.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R3.0mm |
| Contact Resistance | 30 mΩ MAX |
| Dimensions | According to specific model |
| Insulation Resistance | 500MQMIN |
| Material | Main body: LCP UL 94V-0; Housing Lock: LCP UL 94V-0; Terminal: Phosphor Bronze; Contact: Phosphor Bronze |
| Number of Contact Pairs | 14 |
| Number of Insertion and Extraction Cycles | 20,000 cycles |
| Operating Temperature Range | -25℃ to +85℃ |
| Operating Voltage | 50V |
| Pitch | 2.0mm |
| Transmission Rate | 1000Mbps |
| Voltage Rating | 50V |
Function And Role
Core Function
Provide a secure, surface-mountable connection for flat flexible cables (FFC/FPC) with slide lock mechanism
Key Characteristics
- 14-pin configuration
- Bottom contact design
- 0.5mm pitch spacing
- Operating temperature range -55°C to +85°C
- Tin-plated phosphor bronze contacts
- Right-angle surface mount packaging
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
- Medical device connectors
Extended Scenarios
- Industrial automation equipment
- Aerospace instrument systems
- Underwater communication devices
Precautions
| Soldering | Require precise reflow soldering (peak 250°C) for SMD packaging |
| Current Limit | Max current not specified in parameters |
| Voltage Limit | Max voltage not specified in parameters |
| Thermal Management | Generate ~2W heat dissipation at max load |
| Storage | Store in dry environment below 85°C |
| Risk Warnings |
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Alternative Model Params
- Contact material (phosphor bronze vs. beryllium copper)
- Pitch tolerance (0.5±0.05mm vs. 0.5±0.1mm)
- Operating temperature range extension
Design Recommendations
| Layout | Maintain 3mm trace clearance from connector edges |
| Thermal | Use copper pours for heat dissipation |
| Compatibility | Verify FPC thickness (0.3mm) compatibility |
| Testing | Perform 500 cycle insertion force testing |
Market Positioning
| Strengths |
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| Weaknesses |
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