0.5-12P XJH2.0 043
Manufacturer
Model
0.5-12P XJH2.0 043
Category
The SHOU HAN 0.5-12P XJH2.0 043 surface mount FFC/FPC connector provides a compact, reliable interconnect solution for high-density applications requiring operating temperatures from -55°C to +85°C. Its 12-position bottom contact design with 0.5mm pitch supports flexible circuit integration in consumer electronics, automotive displays, and industrial devices. Engineers should prioritize proper soldering techniques and thermal management to maximize lifespan while adhering to contact count and plating requirements.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | R3.0mm |
| Contact Resistance | ≤100mΩ |
| Dimensions | According to specific model |
| Insulation Resistance | ≥500MΩ |
| Material | Main body: LCP UL 94V-0; Housing Lock: LCP UL 94V-0; Terminal: Phosphor Bronze; Contact: Phosphor Bronze |
| Number of Contact Pairs | 12 |
| Number of Insertion and Extraction Cycles | ≥10000 cycles |
| Operating Temperature Range | -55℃ ~ +85℃ |
| Operating Voltage | AC/DC(Voltage RMS) 50Hz |
| Pitch | 2.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
Connects flexible circuits (FFC/FPC) to rigid PCBs in surface mount applications
Key Characteristics
- Flip type design
- 12-position contacts
- 0.5mm pitch
- Surface Mount with Right Angle
- Bottom Contact configuration
- Tin-plated brass contacts
- Operating temperature range -55°C to +85°C
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
- Medical device connectivity
Extended Scenarios
- Industrial automation equipment
- Aerospace component interconnects
- Housing-constrained IoT devices
Precautions
| Soldering | Use 300-350°C soldering temperature with 3-5 seconds contact time to avoid pad lifting |
| Current Limit | Max current not specified (requires derating for high-power applications) |
| Voltage Limit | Operating voltage not specified (ensure proper insulation for AC/DC applications) |
| Thermal Management | Maintain junction temperature below +125°C during operation |
| Storage | Store in <10% relative humidity, static-free environment |
| Risk Warnings |
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Alternative Model Params
- Contact count (12P required)
- Pitch tolerance ±0.1mm
- Plating type (Tin preferred)
- Material (Brass mandatory)
- Mounting style (Surface Mount required)
Design Recommendations
| Layout | Ensure 2mm vertical space above PCB for connector insertion |
| Thermal | Use thermal vias in adjacent layers for heat dissipation |
| Compatibility | Verify FPC thickness (0.3mm) matches connector slot dimensions |
| Testing | Perform 1000-cycle insertion tests per IEC 61058-2 |
Market Positioning
| Strengths |
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| Weaknesses |
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