0.5-10P CTSJ-H2.0 119
Manufacturer
Model
0.5-10P CTSJ-H2.0 119
Category
The SHOU HAN 0.5-10P CTSJ-H2.0 connector is a surface mount FFC/FPC interconnect featuring a 10-contact design with 0.5mm pitch, operating from -55℃ to +85℃. Its Slide Lock mechanism ensures secure mating in consumer electronics, automotive displays, and industrial automation applications. Key design considerations include soldering at controlled temperatures, mechanical stability in flexible circuit layouts, and compliance with RoHS standards. The connector is cost-competitive for volume production but limited to 10P configurations and requires careful thermal management during assembly.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | 1.5mm |
| Contact Resistance | 30 mΩ MAX |
| Data Transfer Rate | 100Mbps |
| Dimensions | According to specific model |
| Insertion and Extraction Cycles | 20,000 cycles |
| Insulation Resistance | 500MQMIN |
| Material | Main body: LCP UL 94V-0; Housing, Terminal, Contact: Phosphor Bronze |
| Number of Contact Pairs | 10P |
| Operating Temperature Range | -25℃ to +85℃ |
| Operating Voltage | 50V |
| Pitch | 2.0mm |
| Voltage Rating | 50V |
Function And Role
Core Function
Connecting flexible circuits (FFC/FPC) in surface mount applications
Key Characteristics
- Slide Lock mechanism
- 10 contact points
- 0.5mm pitch
- Phosphor Bronze contacts with Tin plating
- Operating temperature range -55℃~+85℃
- Surface Mount (SMD) design
Application Domains
Basic Scenarios
- Consumer electronics with rigid-to-flexible circuit integration
- Automotive interior displays
- Medical devices requiring flexible interconnects
Extended Scenarios
- Industrial automation control panels
- Aerospace equipment with harsh environmental requirements
- wearable technology with space-constrained designs
Precautions
| Soldering | Maintain soldering temperature <280℃ and exposure time <5 seconds to prevent pad lifting |
| Current Limit | Max current not specified (requires verification via datasheet) |
| Voltage Limit | Operating voltage not specified (check for application-specific limits) |
| Thermal Management | Ensure proper heat dissipation from 2mm board height profile |
| Storage | Store in <10% relative humidity, temperature controlled environments |
| Risk Warnings |
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Alternative Model Params
- Contact count (10P minimum)
- Pitch tolerance ±0.1mm
- Plating thickness ≥0.5μm
- Material certification (RoHS/REACH)
Design Recommendations
| Layout | Maintain 1.5x pitch spacing for reflow soldering stability |
| Thermal | Use thermal vias under contact pads for heat dissipation |
| Compatibility | Verify FFC thickness (0.3mm) with connector clamping force |
| Testing | Perform 5000 cycle insertion test per IEC 61032-2 |
Market Positioning
| Strengths |
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| Weaknesses |
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