0.3K-HX-51PWB
Manufacturer
Model
0.3K-HX-51PWB
Category
The HDGC 0.3K-HX-51PWB provides a robust surface-mount interconnect solution for flexible circuits with a -55°C to +85°C operational range, 51 contacts, and 0.3mm pitch. Ideal for consumer electronics and automotive applications requiring space-efficient, high-reliability interconnects, though current/voltage limits require careful validation. Right-angle design and flip-type locking enhance PCB layout flexibility while maintaining thermal performance under extreme conditions.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | Not provided |
| Contact Resistance | Not provided |
| Data Transfer Rate | Not provided |
| Dimensions | Not provided |
| Insulation Resistance | Not provided |
| Material | Not provided |
| Number of Contact Pairs | Not provided |
| Number of Insertion/Extraction Cycles | Not provided |
| Operating Temperature Range | Not provided |
| Operating Voltage | Not provided |
| Pitch | 1.0mm |
| Voltage Rating | Not provided |
Function And Role
Core Function
Connects flexible flat cables (FFC/FPC) to rigid boards with surface mount and right-angle installation
Key Characteristics
- 51P contact configuration
- 0.3mm pitch spacing
- Flip-type locking mechanism
- Operating temperature range -55°C to +85°C
- 0.2mm-thick FFC/FPC compatibility
- 1mm height above board
Application Domains
Basic Scenarios
- Consumer electronics (wearables, portable devices)
- Automotive interior controls
- Medical devices requiring flexible interconnects
Extended Scenarios
- Aerospace systems with harsh thermal environments
- Industrial automation equipment
- Underwater/undervehicle applications
Precautions
| Soldering | Use reflow soldering with peak temperature ≤250°C and 3-second exposure per pad |
| Current Limit | Max current not specified (verify with manufacturer) |
| Voltage Limit | Max voltage not specified (verify with manufacturer) |
| Thermal Management | Avoid continuous operation above 85°C without heat dissipation |
| Storage | Store in <10% relative humidity, <30°C environment |
| Risk Warnings |
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Alternative Model Params
- Pitch tolerance (0.3±0.05mm)
- Contact resistance (<50mΩ)
- Operating temperature range
- Mounting height (1±0.2mm)
- FFC/FPC thickness (0.2±0.05mm)
Design Recommendations
| Layout | Place connectors in board corners for stress distribution |
| Thermal | Add 10mm copper pour around connector pads |
| Compatibility | Validate with 0.3mm pitch SMD assembly lines |
| Testing | Perform high-cycle life testing (≥10,000 cycles) |
Market Positioning
| Strengths |
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| Weaknesses |
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