0.3K-HX-35PWB
Manufacturer
Model
0.3K-HX-35PWB
Category
The HDGC 0.3K-HX-35PWB is a 35-position surface mount connector designed for flexible circuit integration in extreme temperature environments. Its right angle configuration and flip-type locking provide space efficiency and secure mechanical retention, making it suitable for consumer electronics, medical devices, and automotive applications. Key considerations include maintaining soldering temperatures below 300°C, verifying voltage/current requirements, and ensuring proper thermal management. The connector offers competitive pricing with volume discounts but requires careful handling to avoid static discharge damage.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | 1.5mm |
| Contact Resistance | 10mΩ |
| Data Transfer Rate | 100Mbps |
| Dimensions | According to specific pin configuration |
| Insulation Resistance | ≥5000MΩ |
| Material | Copper/Polysulfone |
| Number of Contact Pairs | 35 |
| Number of Insertion/Extraction Cycles | 10000 |
| Operating Temperature Range | -40℃ to +85℃ |
| Operating Voltage | 3.3V |
| Pitch | 0.3mm |
| Voltage Rating | 5V |
Function And Role
Core Function
Connects flexible circuits (FFC/FPC) to PCBs in surface mount configurations
Key Characteristics
- 35P contact count
- 0.3mm pitch and 0.3mm surface mount spacing
- Right angle design
- Flip-type locking mechanism
- -55°C to +85°C operating temperature range
Application Domains
Basic Scenarios
- Consumer electronics (smartphones/wearables) requiring compact connectors
- Medical devices with flexible circuit integration
Extended Scenarios
- Automotive interior panels with extreme temperature exposure
- Aerospace applications requiring high reliability
Precautions
| Soldering | Maintain soldering temperature below 300°C to prevent pad lifting |
| Current Limit | Max current not specified (requires verification) |
| Voltage Limit | Operating voltage not specified ( verify per application) |
| Thermal Management | Ensure proper heat dissipation from right angle contacts |
| Storage | Store in <10% relative humidity environments |
| Risk Warnings |
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Alternative Model Params
- Contact count (must match application requirements)
- Pitch tolerance (±0.05mm recommended)
- Operating temperature range
- Locking mechanism type
Design Recommendations
| Layout | Use 3mm minimum trace width for adjacent connectors |
| Thermal | Apply 0.5mm-thick copper pour for heat sinking |
| Compatibility | Verify FFC thickness (0.2mm specified) against PCB stackup |
| Testing | Test insertion force <50N and contact resistance <1mΩ |
Market Positioning
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| Weaknesses |
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