0.3K-HX-33PWB
Manufacturer
Model
0.3K-HX-33PWB
Category
The HDGC 0.3K-HX-33PWB is a high-performance surface mount FFC/FPC connector optimized for space-constrained applications. Its flip-type locking, 33 contact points, and 0.3mm pitch enable reliable connections in consumer electronics, medical devices, and harsh environments. Key features include a 1mm PCB height, 0.2mm FFC compatibility, and operating range to -55°C. Critical design parameters include soldering at ≤250°C, current limits of 1A, and storage in controlled environments. While offering superior thermal stability and mechanical durability, its higher cost and limited configuration options may restrict use in cost-sensitive projects.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | Not less than 3.0mm |
| Contact Resistance | ≤50mΩ |
| Dimensions | Specific dimensions for model 0.3K-HX-33PWB are not explicitly given in the document |
| Insulation Resistance | ≥1000MΩ |
| Material | Specific material for model 0.3K-HX-33PWB is not explicitly given in the document |
| Number of Contact Pads | 33 |
| Number of Insertion and Extraction Cycles | ≥10000 times |
| Operating Temperature Range | -40℃ to +85℃ |
| Operating Voltage | 3.3V |
| Pitch | 1.0mm |
| Transmission Rate | ≥100Mbps |
| Voltage Rating | ≤30V |
Function And Role
Core Function
Provides secure electrical connections between flexible circuits (FFC/FPC) and printed circuit boards (PCB) in surface mount configurations.
Key Characteristics
- Flip-type locking mechanism
- 33 contact points (33P)
- 0.3mm pitch spacing
- 1mm height above PCB
- 0.2mm thick FFC/FPC compatibility
- Right-angle surface mount design
Application Domains
Basic Scenarios
- Consumer electronics with space-constrained designs
- Medical devices requiring flexible interconnects
- Industrial equipment with frequent flexure
Extended Scenarios
- Automotive interior displays
- Aerospace avionics
- wearable technology
- Robotics with articulated joints
Precautions
| Soldering | Max soldering temperature: 250°C (2 seconds/point); avoid prolonged heat exposure |
| Current Limit | Continuous current: 1A per contact |
| Voltage Limit | Max voltage: 30VDC |
| Thermal Management | Thermal dissipation requires copper pour >10mm² near contacts |
| Storage | Store in <10% RH, 15-25°C environments |
| Risk Warnings |
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Alternative Model Params
- Operating temperature (-40°C to +100°C)
- Contact count (28-40P range)
- Pitch tolerance (0.25-0.35mm)
- Mounting type (surface mount only)
Design Recommendations
| Layout | Use 0.5mm trace width for signal lines; maintain 2mm spacing between contacts |
| Thermal | Implement thermal vias under high current paths |
| Compatibility | Verify FFC/FPC supplier for 0.2mm thickness tolerance |
| Testing | Perform 500 cycle bend test (Bend test: 180°/mm, 20Hz) before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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