0.3K-HX-21PWB
Manufacturer
Model
0.3K-HX-21PWB
Category
The HDGC 0.3K-HX-21PWB is a high-reliability 21-position FFC/FPC connector optimized for space-constrained applications requiring operating temperatures from -55°C to +85°C. Its 0.3mm pitch and surface mount design supports fine-pitch PCB assembly while the flip lock feature enhances durability in dynamic environments. Ideal for consumer electronics and automotive systems where mechanical stability and thermal performance are critical.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | 1.5mm |
| Contact Resistance | 10mΩ |
| Dimensions | According to specific pin configuration |
| Insertion and Extraction Cycles | 10000 cycles |
| Insulation Resistance | ≥5000MΩ |
| Material | Copper/Polysulfone |
| Number of Contact Pairs | 21 |
| Operating Temperature Range | -40℃ to +85℃ |
| Operating Voltage | 3.3V |
| Pitch | 0.3mm |
| Transmission Rate | 100Mbps |
| Voltage Rating | 30V |
Function And Role
Core Function
21-Position Flip Type FFC/FPC Surface Mount Connector
Key Characteristics
- 0.3mm Pitch
- 0.2mm FFC Thickness
- 1mm Board Height
- Operating Temperature: -55°C to +85°C
- Flip Type Locking Feature
- Surface Mount with Right Angle
Application Domains
Basic Scenarios
- Consumer Electronics (Smartphones/Tablets)
- Automotive Instrument Clusters
- Industrial Control Systems
Extended Scenarios
- Medical Devices (Wearable/Imaging)
- Aerospaceavionics
- Underwater ROV Deployments
Precautions
| Soldering | Use 300-350°C reflow profile with 20-30s peak time |
| Current Limit | Max 0.5A per contact (requires derating to 0.3A at +85°C) |
| Voltage Limit | Max 30V DC between contacts |
| Thermal Management | Thermal resistance: 60°C/W (PCB copper pad required) |
| Storage | Store in anti-static bags at 10-40°C with 30-50% RH |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.25-0.5mm)
- Contact Count (12-24P)
- Operating Temp (-40°C to +100°C)
- Current Rating (0.2-1A)
Design Recommendations
| Layout | Ensure 0.3mm+ trace spacing and 3x pad dimension |
| Thermal | Use 2-layer copper and thermal vias for heat dissipation |
| Compatibility | Verify with 0.2mm/0.3mm FPC materials |
| Testing | Perform 500C cycles and 1000V ESD testing |
Market Positioning
| Strengths |
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| Weaknesses |
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