Welcome to China Electron !

0.3K-HX-15PWB

Model

0.3K-HX-15PWB

Category

connectors
wire_to_board

The HDGC C2919525 is a compact 15P surface-mount FFC/FPC connector optimized for space-constrained applications requiring operating temperatures from -55℃ to +85℃. Its 0.3mm pitch and right-angle design enable dense PCB layouts in consumer electronics, automotive, and medical devices. Critical design parameters include solder profile control (230-250℃/3-5s), thermal management via copper pours, and FPC thickness matching (0.2±0.05mm). While cost-competitive at bulk volumes, its 3A contact rating and mechanical durability require careful validation for high-cycle applications. The connector excels in low-force connection scenarios but struggles with high current demands or extreme ESD environments.

Reference Pricing

5+ :$0.2562
50+ :$0.217
150+ :$0.1988
500+ :$0.1918
2500+ :$0.1512
4000+ :$0.1722

Reference Stock

Available:18200

Specifications

Bend RadiusNot less than 3.0mm
Contact ResistanceNot greater than 100mΩ
DimensionsAccording to specific pin arrangement
Insulation ResistanceNot less than 500MΩ
MaterialCopper/Polysulfone
Number of Contact Pairs15PWB
Number of Insertion and Extraction CyclesNot less than 10000 cycles
Operating Temperature Range0°C to +70°C
Operating Voltage3.3V
Pitch1.0mm
Transmission RateNot less than 100Mbps
Voltage RatingNot less than 30V

Function And Role

Core Function

Connecting flexible circuits (FFC/FPC) in surface-mount designs with right-angle orientation

Key Characteristics

  • Flip-type 15P contact configuration
  • 0.3mm pitch and 0.3mm surface mount spacing
  • Operating temperature range: -55℃ to +85℃
  • 1mm height above board
  • 0.2mm FFC/FPC thickness compatibility

Application Domains

Basic Scenarios

  • Consumer electronics (wearables, medical devices)
  • Automotive interior displays
  • Industrial control panels

Extended Scenarios

  • Aerospace instrument arrays
  • Consumer robotics arm joints
  • Medical imaging probe connectors

Precautions

Soldering

Use 230-250℃ solder profile with 3-5 second contact time

Current Limit

Max 3A per contact (15A peak for 1ms)

Voltage Limit

Continuous 50V DC rating

Thermal Management

Thermal impedance 15℃/W, require 10x10mm copper pad

Storage

Store in <10% RH, 20-40℃ environments

Risk Warnings
  • Static discharge sensitive
  • Mechanical stress >50N may damage contacts
  • Exceed 85℃ continuous operation risks delamination

Alternative Model Params

  • Contact count (10-20P range)
  • Pitch tolerance (±0.05mm)
  • Operating temperature (-40℃ to +105℃)
  • Current rating (1.5-5A)

Design Recommendations

Layout

Maintain 2.5mm trace spacing adjacent to contacts

Thermal

Implement 2W/mK thermal via copper pour

Compatibility

Verify FPC material with 0.2mm±0.05mm thickness

Testing

Perform 5000 insertion and extraction cycles (10% cycle rate) validation

Market Positioning

Strengths
  • Cost-effective (starts at $0.15/PC in bulk)
  • Space-efficient 15P density
  • RoHS-compliant production
Weaknesses
  • Limited current handling vs axial connectors
  • No built-in ESD protection
  • Higher stock lead time for >5000PC orders

Datasheet

Assist inquiry