0.3K-HX-13PWB
Manufacturer
Model
0.3K-HX-13PWB
Category
The HDGC 0.3K-HX-13PWB is a high-reliability surface mount connector designed for flexible circuit integration, offering temperature resilience from -55℃ to +85℃ with 13 contacts in a 0.3mm pitch configuration. Ideal for consumer electronics and automotive applications requiring space-efficient interconnections, its flip-type locking mechanism ensures secure mating while maintaining compliance with RoHS standards. The component's compact 1mm profile and right-angle mounting simplify PCB layout in constrained environments, though extended use in high-vibration automotive systems may require additional mechanical reinforcement.
Reference Pricing
Reference Stock
Specifications
| Bend Radius | 1.5mm |
| Contact Resistance | 100mΩ |
| Data Transfer Rate | 100Mbps |
| Dimensions | According to specific pin configuration |
| Insertion/Removal Cycles | 10000 cycles |
| Insulation Resistance | ≥5000MΩ |
| Material | Copper/Polysulfone |
| Number of Contact Pairs | 13 |
| Operating Temperature Range | -40℃ to +85℃ |
| Operating Voltage | 3.3V |
| Pitch | 0.3mm |
| Voltage Rating | 10V |
Function And Role
Core Function
13-position surface mount connector for flexible printed circuits (FFC/FPC) with flip-type locking mechanism
Key Characteristics
- 0.3mm pitch spacing
- 1mm height above board
- Operating temperature range: -55℃ to +85℃
- Right-angle surface mount configuration
- 0.2mm thick FFC/FPC compatibility
Application Domains
Basic Scenarios
- Consumer electronics (wearables, portable devices)
- Medical devices with rigid-to-flexible transitions
- Automotive interior displays
Extended Scenarios
- Industrial automation sensors
- Aerospace instrumentation harnesses
- Underwater ROV cable systems
Precautions
| Soldering | Use 260-280℃ solder profile with 3-5s contact time; avoid excessive heat application |
| Current Limit | Max continuous current: 0.5A |
| Voltage Limit | Working voltage: 30V AC/DC |
| Thermal Management | Thermal resistance: 50℃/W; require 10×10mm heat dissipation area |
| Storage | Store in <10% RH, 15-25℃ environment with anti-static packaging |
| Risk Warnings |
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Alternative Model Params
- Pitch tolerance (±0.05mm)
- Contact resistance (<10mΩ)
- Operating temperature range (-40℃ to +100℃)
- Connector type (FFC vs FPC)
Design Recommendations
| Layout | Ensure 2mm clearance from adjacent components |
| Thermal | Implement copper pour heat sinking |
| Compatibility | Verify with 0.2-0.5mm thickness FPCs |
| Testing | Perform 500 cycle insertion/pull testing |
Market Positioning
| Strengths |
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| Weaknesses |
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