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0.3K-HX-11PWB

Model

0.3K-HX-11PWB

Category

connectors
wire_to_board

The HDGC 0.3K-HX-11PWB is a surface-mount FFC/FPC connector with 11 contacts, 0.3mm pitch, and flip-type locking for reliable interconnects in extreme environments. Ideal for consumer electronics and automotive applications requiring compact, high-reliability solutions.

Reference Pricing

5+ :$0.2898
50+ :$0.2618
150+ :$0.238
500+ :$0.1932
2500+ :$0.1806
5000+ :$0.1722

Reference Stock

Available:7126

Specifications

Bending Radius1.5mm
Contact Resistance10mΩ
DimensionsAccording to specific pin configuration
Insulation Resistance1000MΩ
MaterialCopper/Polysulfone
Number of Contact Pads11P
Number of Insertion/Extraction Cycles10000 times
Operating Temperature Range-40℃ to +85℃
Operating Voltage3.3V
Pitch0.3mm
Transmission Rate100Mbps
Voltage Rating30V

Function And Role

Core Function

Connects flexible circuits (FFC/FPC) to PCBs with surface mount and right-angle orientation

Key Characteristics

  • 11P contact count
  • 0.3mm pitch
  • Flip type locking feature
  • Operating temperature -55°C to +85°C
  • 1mm height above board
  • 0.2mm FFC/FPC thickness

Application Domains

Basic Scenarios

  • Consumer electronics (smartphones, wearables)
  • Automotive interior displays

Extended Scenarios

  • Medical devices with harsh environments
  • Aerospace applications requiring thermal resilience

Precautions

Soldering

Use high-temperature resistant solder paste and avoid prolonged heat exposure (>300°C)

Current Limit

Max current not specified; verify with datasheet

Voltage Limit

Max voltage not specified; verify with datasheet

Thermal Management

Ensure proper heat dissipation due to 1mm board height

Storage

Store in moisture-free environments below 30°C

Risk Warnings
  • Static discharge hazard
  • Mechanical stress may damage flexible contacts

Alternative Model Params

  • Operating temperature range
  • Contact count
  • Pitch (0.3mm)
  • Mounting type (Surface Mount)
  • FFC/FPC thickness

Design Recommendations

Layout

Ensure 2mm spacing between adjacent connectors

Thermal

Use thermal vias for heat dissipation in high-power applications

Compatibility

Verify FFC/FPC supplier for 0.2mm thickness compatibility

Testing

Perform bend endurance testing for >10,000 cycles

Market Positioning

Strengths
  • Robust -55°C to +85°C operation
  • Compact 0.3mm pitch design
  • Cost-effective bulk pricing
Weaknesses
  • Limited supplier options
  • Minimum order quantity of 5 units

Datasheet

Assist inquiry