0.3K-HX-11PWB
Manufacturer
Model
0.3K-HX-11PWB
Category
The HDGC 0.3K-HX-11PWB is a surface-mount FFC/FPC connector with 11 contacts, 0.3mm pitch, and flip-type locking for reliable interconnects in extreme environments. Ideal for consumer electronics and automotive applications requiring compact, high-reliability solutions.
Reference Pricing
Reference Stock
Specifications
Bending Radius | 1.5mm |
Contact Resistance | 10mΩ |
Dimensions | According to specific pin configuration |
Insulation Resistance | 1000MΩ |
Material | Copper/Polysulfone |
Number of Contact Pads | 11P |
Number of Insertion/Extraction Cycles | 10000 times |
Operating Temperature Range | -40℃ to +85℃ |
Operating Voltage | 3.3V |
Pitch | 0.3mm |
Transmission Rate | 100Mbps |
Voltage Rating | 30V |
Function And Role
Core Function
Connects flexible circuits (FFC/FPC) to PCBs with surface mount and right-angle orientation
Key Characteristics
- 11P contact count
- 0.3mm pitch
- Flip type locking feature
- Operating temperature -55°C to +85°C
- 1mm height above board
- 0.2mm FFC/FPC thickness
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
Extended Scenarios
- Medical devices with harsh environments
- Aerospace applications requiring thermal resilience
Precautions
Soldering | Use high-temperature resistant solder paste and avoid prolonged heat exposure (>300°C) |
Current Limit | Max current not specified; verify with datasheet |
Voltage Limit | Max voltage not specified; verify with datasheet |
Thermal Management | Ensure proper heat dissipation due to 1mm board height |
Storage | Store in moisture-free environments below 30°C |
Risk Warnings |
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Alternative Model Params
- Operating temperature range
- Contact count
- Pitch (0.3mm)
- Mounting type (Surface Mount)
- FFC/FPC thickness
Design Recommendations
Layout | Ensure 2mm spacing between adjacent connectors |
Thermal | Use thermal vias for heat dissipation in high-power applications |
Compatibility | Verify FFC/FPC supplier for 0.2mm thickness compatibility |
Testing | Perform bend endurance testing for >10,000 cycles |
Market Positioning
Strengths |
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Weaknesses |
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