0.5-54PFGPZ
Manufacturer
Model
0.5-54PFGPZ
Category
The C30732 is a 54P right-angle surface mount connector designed for flexible circuit integration in consumer electronics, automotive, and industrial applications. Its 0.5mm pitch and bottom contact configuration enable compact designs while maintaining 1A current handling and 30V voltage tolerance. Soldering requires controlled reflow profiles to avoid pad lifting, and thermal management demands careful layout planning due to 2mm board height constraints. The connector is ideal for space-constrained devices but lacks high-voltage options and IP-rated variants, limiting use in harsh environments.
Reference Pricing
Reference Stock
Specifications
| Bending Radius | 6.40mm |
| Contact Resistance | 10mΩ |
| Data Transfer Rate | 1.5Gbps |
| Dimensions | Varies with the number of pins |
| Insulation Resistance | ≥5000MΩ |
| Material | Copper Alloy |
| Number of Contact Pairs | 54 |
| Number of Insertion/Extraction Cycles | 1000 cycles |
| Operating Temperature Range | -40℃ to +85℃ |
| Operating Voltage | 3.3V |
| Pin Pitch | 2.60mm |
| Voltage Rating | 5V |
Function And Role
Core Function
Connecting flexible printed circuits (FFC/FPC) in surface mount applications
Key Characteristics
- Flip type design
- 54P contact count
- 0.5mm pitch
- Right angle surface mount
- Bottom contact configuration
- 2mm board height
Application Domains
Basic Scenarios
- Consumer electronics (smartphones, wearables)
- Automotive interior displays
- Medical device connectivity
Extended Scenarios
- Aerospace components requiring space efficiency
- Industrial automation systems
- Haptic feedback mechanisms
Precautions
| Soldering | Use reflow soldering with peak temperatures ≤250°C and 2-3 second pad engagement |
| Current Limit | Max continuous current 1A per contact |
| Voltage Limit | Operating voltage up to 30V DC |
| Thermal Management | Critical for boards with ≤5W heat dissipation per square inch |
| Storage | Store in <10% relative humidity environments within 10x10x10cm packaging |
| Risk Warnings |
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Alternative Model Params
- Pitch (0.3-1.0mm range)
- Contact density (20-100P)
- Encapsulation type (SMD/through-hole)
- Operating temp range (-40°C to +125°C)
Design Recommendations
| Layout | Maintain 3mm trace spacing for adjacent connectors |
| Thermal | Implement copper pour grounding within 5mm of contacts |
| Compatibility | Verify FPC thickness (0.1-0.3mm) with connector clamping force |
| Testing | Perform 10,000 insertion/removal cycles at 5Hz frequency |
Market Positioning
| Strengths |
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| Weaknesses |
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